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Hidekazu Manabe
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming leads of a semiconductor device
Patent number
7,077,170
Issue date
Jul 18, 2006
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for removing tiebars after molding of semiconductor chip
Patent number
6,925,922
Issue date
Aug 9, 2005
Renesas Technology Corp.
Hidekazu Manabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
Patent number
6,363,976
Issue date
Apr 2, 2002
Mitsubishi Electric Engineering Co., Ltd.
Hideji Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead forming apparatus and lead forming method
Patent number
5,950,687
Issue date
Sep 14, 1999
Mitsubishi Denki Kabushiki Kaisha
Hidekazu Manabe
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of forming leads of a packaged semiconductor device
Publication number
20060237087
Publication date
Oct 26, 2006
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for removing tiebars after molding of semiconductor chip
Publication number
20050230789
Publication date
Oct 20, 2005
Renesas Technology Corp.
Hidekazu Manabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lead forming for a semiconductor device
Publication number
20050076967
Publication date
Apr 14, 2005
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Apparatus for removing tiebars after molding of semiconductor chip
Publication number
20030079734
Publication date
May 1, 2003
Mitsubishi Denki Kabushiki Kaisha
Hidekazu Manabe
H01 - BASIC ELECTRIC ELEMENTS