Hidekazu Okabayashi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper interconnection
- Patent number 6,670,639
- Issue date Dec 30, 2003
- NEC Corporation
- Hidekazu Okabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an aluminum film used as an interconnect in a se...
- Patent number 5,545,591
- Issue date Aug 13, 1996
- NEC Corporation
- Kazumi Sugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 5,308,792
- Issue date May 3, 1994
- NEC Corporation
- Hidekazu Okabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 4,558,507
- Issue date Dec 17, 1985
- NEC Corporation
- Hidekazu Okabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming electrodes and interconnections on silicon semic...
- Patent number 4,551,908
- Issue date Nov 12, 1985
- Nippon Electric Co., Ltd.
- Eiji Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having a plurality of insul...
- Patent number 4,348,746
- Issue date Sep 7, 1982
- Nippon Electric Co., Ltd.
- Hidekazu Okabayashi
- G11 - INFORMATION STORAGE