Hidekazu TANISAWA

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Niiza-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,462,449
- Issue date Oct 4, 2022
- Nissan Motor Co., Ltd.
- Hiroshi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure of a semiconductor device
- Patent number 10,461,050
- Issue date Oct 29, 2019
- Fuji Electric Co., Ltd.
- Hidekazu Tanisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220044980
- Publication date Feb 10, 2022
- NISSAN MOTOR CO., LTD.
- Hiroshi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180114765
- Publication date Apr 26, 2018
- Fuji Electric Co., Ltd.
- Hidekazu Tanisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AU-BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR...
- Publication number 20160293522
- Publication date Oct 6, 2016
- NISSAN MOTOR CO., LTD.
- Satoshi TANIMOTO
- H01 - BASIC ELECTRIC ELEMENTS