Hideki AKIBA

Person

Annaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-modified glass fiber film
- Patent number 10,669,197
- Issue date Jun 2, 2020
- Shin-Etsu Chemical Co., Ltd.
- Saiko Akahane
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Base-attached encapsulant for semiconductor encapsulation, semicond...
- Patent number 10,242,924
- Issue date Mar 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus using a base-attac...
- Patent number 10,177,059
- Issue date Jan 8, 2019
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave shielding support base-attached encapsulant, e...
- Patent number 9,865,518
- Issue date Jan 9, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant with base for use in semiconductor encapsulation, semic...
- Patent number 9,449,856
- Issue date Sep 20, 2016
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor apparatus and method for producing the same
- Patent number 9,401,290
- Issue date Jul 26, 2016
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for producing the same
- Patent number 9,362,145
- Issue date Jun 7, 2016
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support base-attached encapsulant, encapsulated substrate having se...
- Patent number 9,312,197
- Issue date Apr 12, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fiber-containing resin substrate, device-mounting substrate and dev...
- Patent number 9,287,174
- Issue date Mar 15, 2016
- Shin-Etsu Chemical Co., Ltd.
- Susumu Sekiguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulant, encapsulated substrate having semiconductor devices mo...
- Patent number 9,129,912
- Issue date Sep 8, 2015
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor apparatus and semiconductor a...
- Patent number 9,129,976
- Issue date Sep 8, 2015
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealant laminated composite, sealed semiconductor devices mounting...
- Patent number 8,872,358
- Issue date Oct 28, 2014
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin resolution composition, polyimide resin, and semiconductor de...
- Patent number 8,034,893
- Issue date Oct 11, 2011
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Primer composition for semiconductor-encapsulating epoxy resin mold...
- Patent number 7,714,080
- Issue date May 11, 2010
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Partial block polyimide-polysiloxane copolymer, making method, and...
- Patent number 7,683,152
- Issue date Mar 23, 2010
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer dicing/die bonding sheet
- Patent number 7,147,920
- Issue date Dec 12, 2006
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive resin composition
- Patent number 7,026,382
- Issue date Apr 11, 2006
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Phenolic hydroxyl-bearing polyimide resin, making method and polyim...
- Patent number 6,949,619
- Issue date Sep 27, 2005
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICOND...
- Publication number 20180025958
- Publication date Jan 25, 2018
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICOND...
- Publication number 20170330813
- Publication date Nov 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...
- Publication number 20170282527
- Publication date Oct 5, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20170110415
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, METHOD F...
- Publication number 20170098551
- Publication date Apr 6, 2017
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20160141268
- Publication date May 19, 2016
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SUPPORT BASE-ATTACHED ENCAPSULANT, E...
- Publication number 20160133579
- Publication date May 12, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET AND SEMICONDUCTOR APPARATUS
- Publication number 20160044839
- Publication date Feb 11, 2016
- Shin-Etsu Chemical Co., Ltd.
- Saiko AKAHANE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEV...
- Publication number 20160043012
- Publication date Feb 11, 2016
- Shin-Etsu Chemical Co., Ltd.
- Susumu SEKIGUCHI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SE...
- Publication number 20160035638
- Publication date Feb 4, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- B32 - LAYERED PRODUCTS
Information Patent Application
VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...
- Publication number 20150235871
- Publication date Aug 20, 2015
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-MODIFIED GLASS FIBER FILM
- Publication number 20150197885
- Publication date Jul 16, 2015
- Shin-Etsu Chemical Co., Ltd.
- Saiko AKAHANE
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMIC...
- Publication number 20150028497
- Publication date Jan 29, 2015
- Shin-Etsu Chemical Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING...
- Publication number 20140264956
- Publication date Sep 18, 2014
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- B32 - LAYERED PRODUCTS
Information Patent Application
FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEV...
- Publication number 20140138856
- Publication date May 22, 2014
- Shin-Etsu Chemical Co., Ltd.
- Susumu SEKIGUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTR...
- Publication number 20140138857
- Publication date May 22, 2014
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20140091483
- Publication date Apr 3, 2014
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20130241087
- Publication date Sep 19, 2013
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING...
- Publication number 20130200534
- Publication date Aug 8, 2013
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- B32 - LAYERED PRODUCTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20130197129
- Publication date Aug 1, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin solution composition, polyimide resin, and semiconductor device
- Publication number 20070066796
- Publication date Mar 22, 2007
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Primer composition for semiconductor-encapsulating epoxy resin mold...
- Publication number 20060199923
- Publication date Sep 7, 2006
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Partial block polyimide-polysiloxane copolymer, making method , and...
- Publication number 20050261456
- Publication date Nov 24, 2005
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wafer dicing/die bonding sheet
- Publication number 20040105990
- Publication date Jun 3, 2004
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Phenolic hydroxyl-bearing polyimide resin, making method and polyim...
- Publication number 20040019174
- Publication date Jan 29, 2004
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive resin composition
- Publication number 20030216505
- Publication date Nov 20, 2003
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hideki AKIBA

Person

Patents Grantslast 30 patents

Surface-modified glass fiber film

Base-attached encapsulant for semiconductor encapsulation, semicond...

Method for manufacturing semiconductor apparatus using a base-attac...

Electromagnetic wave shielding support base-attached encapsulant, e...

Encapsulant with base for use in semiconductor encapsulation, semic...

Semiconductor apparatus and method for producing the same

Semiconductor apparatus and method for producing the same

Support base-attached encapsulant, encapsulated substrate having se...

Fiber-containing resin substrate, device-mounting substrate and dev...

Encapsulant, encapsulated substrate having semiconductor devices mo...

Method of manufacturing semiconductor apparatus and semiconductor a...

Sealant laminated composite, sealed semiconductor devices mounting...

Resin resolution composition, polyimide resin, and semiconductor de...

Primer composition for semiconductor-encapsulating epoxy resin mold...

Partial block polyimide-polysiloxane copolymer, making method, and...

Wafer dicing/die bonding sheet

Conductive resin composition

Phenolic hydroxyl-bearing polyimide resin, making method and polyim...

Patents Applicationslast 30 patents

BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICOND...

BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICOND...

VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, METHOD F...

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

ELECTROMAGNETIC WAVE SHIELDING SUPPORT BASE-ATTACHED ENCAPSULANT, E...

ELECTROMAGNETIC WAVE SHIELDING SHEET AND SEMICONDUCTOR APPARATUS

FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEV...

SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SE...

VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...

SURFACE-MODIFIED GLASS FIBER FILM

ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMIC...

SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING...

FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEV...

ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTR...

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING...

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Resin solution composition, polyimide resin, and semiconductor device

Primer composition for semiconductor-encapsulating epoxy resin mold...

Partial block polyimide-polysiloxane copolymer, making method , and...

Wafer dicing/die bonding sheet

Phenolic hydroxyl-bearing polyimide resin, making method and polyim...

Conductive resin composition