Hideki Ebihara

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor-sealing-purpose epoxy resin compound producing method
- Patent number 7,521,011
- Issue date Apr 21, 2009
- Hitachi Chemical Company, Ltd.
- Mitsuo Ishikawara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor- sealing -purpose epoxy resin compound producing method
- Publication number 20060017188
- Publication date Jan 26, 2006
- Hitachi Medical Co., Ltd.
- Mitsuo Ishikawara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL