Hideki Eifuku

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board interconnection structure and circuit board interconn...
- Patent number 10,080,298
- Issue date Sep 18, 2018
- Panasonic Corporation
- Hideki Eifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric component mounting method
- Patent number 10,034,389
- Issue date Jul 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic component, electronic component,...
- Patent number 9,949,380
- Issue date Apr 17, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Eifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode joining method, production method of electrode joined str...
- Patent number 9,839,143
- Issue date Dec 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting method of electronic component
- Patent number 9,015,932
- Issue date Apr 28, 2015
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate backing device and substrate thermocompression-bonding de...
- Patent number 8,851,138
- Issue date Oct 7, 2014
- Panasonic Corporation
- Hiroki Maruo
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic component mounting system and electronic component mount...
- Patent number 8,817,487
- Issue date Aug 26, 2014
- Panasonic Corporation
- Koji Motomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting system and electronic component mount...
- Patent number 8,434,665
- Issue date May 7, 2013
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components joining method and components joining structure
- Patent number 8,188,605
- Issue date May 29, 2012
- Panasonic Corporation
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component soldering structure and electronic component s...
- Patent number 8,148,253
- Issue date Apr 3, 2012
- Panasonic Corporation
- Mitsuru Ozono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components mounting adhesive and electronic components m...
- Patent number 8,034,447
- Issue date Oct 11, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 8,025,205
- Issue date Sep 27, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components joining method and components joining structure
- Patent number 8,018,074
- Issue date Sep 13, 2011
- Panasonic Corporation
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric components connecting method
- Patent number 7,886,432
- Issue date Feb 15, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic parts module
- Patent number 7,845,074
- Issue date Dec 7, 2010
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic parts module
- Patent number 7,841,081
- Issue date Nov 30, 2010
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 7,797,822
- Issue date Sep 21, 2010
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic components
- Patent number 7,793,413
- Issue date Sep 14, 2010
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting bumped electronic components
- Patent number 6,209,196
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering bumped work by partially penetrating the oxide...
- Patent number 6,179,198
- Issue date Jan 30, 2001
- Matsushita Electric Industrial Co., Ltd.
- Hideki Eifuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts mounting method
- Patent number 6,000,127
- Issue date Dec 14, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of electronic component having bumps
- Patent number 5,962,925
- Issue date Oct 5, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bonding method
- Patent number 5,749,510
- Issue date May 12, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT,...
- Publication number 20160255716
- Publication date Sep 1, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Hideki EIFUKU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-MOUNTED STRUCTURE
- Publication number 20150208509
- Publication date Jul 23, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20150121692
- Publication date May 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD.
- Hideki Eifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE JOINING METHOD, PRODUCTION METHOD OF ELECTRODE JOINED STR...
- Publication number 20150047185
- Publication date Feb 19, 2015
- PANASONIC CORPORATION
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INTERCONNECTION STRUCTURE AND CIRCUIT BOARD INTERCONN...
- Publication number 20140318837
- Publication date Oct 30, 2014
- PANASONIC CORPORATION
- Hideki EIFUKU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE RECEIVING DEVICE AND SUBSTRATE THERMOCOMPRESSION-BONDING...
- Publication number 20120234496
- Publication date Sep 20, 2012
- Hiroki Maruo
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20120014084
- Publication date Jan 19, 2012
- PANASONIC CORPORATION
- Koji Motomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20120012645
- Publication date Jan 19, 2012
- PANASONIC CORPORATION
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE
- Publication number 20110284265
- Publication date Nov 24, 2011
- PANASONIC CORPORATION
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE
- Publication number 20100327044
- Publication date Dec 30, 2010
- PANASONIC CORPORATION
- Tadahiko Sakai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTING METHOD OF ELECTRONIC COMPONENT
- Publication number 20100018048
- Publication date Jan 28, 2010
- PANASONIC CORPORATION
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20090288767
- Publication date Nov 26, 2009
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS M...
- Publication number 20090291314
- Publication date Nov 26, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE
- Publication number 20090260229
- Publication date Oct 22, 2009
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE
- Publication number 20090260230
- Publication date Oct 22, 2009
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRIC COMPONENTS CONNECTING METHOD
- Publication number 20090229123
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENTS
- Publication number 20090205203
- Publication date Aug 20, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN...
- Publication number 20090161328
- Publication date Jun 25, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT THERMO-COMPRESSION TOOL, AND ELECTRONIC COMPON...
- Publication number 20090126188
- Publication date May 21, 2009
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT SOLDERING STRUCTURE AND ELECTRONIC COMPONENT S...
- Publication number 20090075025
- Publication date Mar 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE
- Publication number 20090047534
- Publication date Feb 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hideki Eifuku

Person

Patents Grantslast 30 patents

Circuit board interconnection structure and circuit board interconn...

Electric component mounting method

Manufacturing method of electronic component, electronic component,...

Electrode joining method, production method of electrode joined str...

Component-mounted structure

Connecting method of electronic component

Substrate backing device and substrate thermocompression-bonding de...

Electronic component mounting system and electronic component mount...

Electronic component mounting system and electronic component mount...

Components joining method and components joining structure

Electronic component soldering structure and electronic component s...

Electronic components mounting adhesive and electronic components m...

Electronic component mounting method

Components joining method and components joining structure

Electric components connecting method

Method for manufacturing electronic parts module

Method for manufacturing electronic parts module

Electronic component mounting method

Method of mounting electronic components

Method of mounting bumped electronic components

Method of soldering bumped work by partially penetrating the oxide...

Electronic parts mounting method

Mounting structure of electronic component having bumps

Semiconductor chip bonding method

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT,...

COMPONENT-MOUNTED STRUCTURE

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNT...

ELECTRODE JOINING METHOD, PRODUCTION METHOD OF ELECTRODE JOINED STR...

CIRCUIT BOARD INTERCONNECTION STRUCTURE AND CIRCUIT BOARD INTERCONN...

SUBSTRATE RECEIVING DEVICE AND SUBSTRATE THERMOCOMPRESSION-BONDING...

ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...

ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...

COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE

CONNECTING METHOD OF ELECTRONIC COMPONENT

ELECTRONIC COMPONENT MOUNTING METHOD

ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS M...

METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE

METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE

ELECTRIC COMPONENTS CONNECTING METHOD

METHOD OF MOUNTING ELECTRONIC COMPONENTS

ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN...

ELECTRONIC COMPONENT THERMO-COMPRESSION TOOL, AND ELECTRONIC COMPON...

ELECTRONIC COMPONENT SOLDERING STRUCTURE AND ELECTRONIC COMPONENT S...

COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE