Hideki Fukumoto

Person

Nagoya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device by backgrinding semic...
- Patent number 11,482,441
- Issue date Oct 25, 2022
- Mitsui Chemicals Tohcello, Inc.
- Hiroyoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer protective film and method of manufacturing sem...
- Patent number 9,966,297
- Issue date May 8, 2018
- Mitsui Chemicals Tohcello, Inc.
- Akimitsu Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of protecting semiconductor wafer and adhesive film for prot...
- Patent number 7,501,312
- Issue date Mar 10, 2009
- Mitsui Chemicals, Inc.
- Takanobu Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface protecting adhesive film for semiconductor wafer and proces...
- Patent number 6,879,026
- Issue date Apr 12, 2005
- Mitsui Chemicals, Inc.
- Hideki Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting method for semiconductor wafer and surface protecting ad...
- Patent number 6,730,595
- Issue date May 4, 2004
- Mitsui Chemicals, Inc.
- Yoshihisa Saimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor wafer
- Patent number 6,273,791
- Issue date Aug 14, 2001
- Mitsui Chemicals, Inc.
- Makoto Kataoka
- B24 - GRINDING POLISHING
Information Patent Grant
Preparation process of semiconductor wafer
- Patent number 6,159,827
- Issue date Dec 12, 2000
- Mitsui Chemicals, Inc.
- Makoto Kataoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190088528
- Publication date Mar 21, 2019
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroyoshi KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER PROTECTIVE FILM AND METHOD OF MANUFACTURING SEM...
- Publication number 20160133500
- Publication date May 12, 2016
- MITSUI CHEMICALS TOHCELLO, INC.
- Akimitsu MORIMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of protecting semiconductor wafer and adhesive film for prot...
- Publication number 20050164509
- Publication date Jul 28, 2005
- Mitsui Chemicals, Inc.
- Takanobu Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface protecting adhesive film for semiconductor wafer and proces...
- Publication number 20030219960
- Publication date Nov 27, 2003
- Mitsui Chemicals, Inc.
- Hideki Fukumoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Protecting method for semiconductor wafer and surface protecting ad...
- Publication number 20020106868
- Publication date Aug 8, 2002
- Yoshihisa Saimoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Hideki Fukumoto

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device by backgrinding semic...

Semiconductor wafer protective film and method of manufacturing sem...

Method of protecting semiconductor wafer and adhesive film for prot...

Surface protecting adhesive film for semiconductor wafer and proces...

Protecting method for semiconductor wafer and surface protecting ad...

Method of producing semiconductor wafer

Preparation process of semiconductor wafer

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER PROTECTIVE FILM AND METHOD OF MANUFACTURING SEM...

Method of protecting semiconductor wafer and adhesive film for prot...

Surface protecting adhesive film for semiconductor wafer and proces...

Protecting method for semiconductor wafer and surface protecting ad...