Hideki Genjo

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having interconnection structure
- Patent number 6,765,251
- Issue date Jul 20, 2004
- Renesas Technology Corp.
- Eiji Hasunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallic fuse member and cutting meth...
- Patent number 6,163,062
- Issue date Dec 19, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Shiratake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including interlaying...
- Patent number 5,250,468
- Issue date Oct 5, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electrically programmable non-volatile m...
- Patent number 5,231,041
- Issue date Jul 27, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Hideaki Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having bit lines formed of an interconn...
- Patent number 5,153,689
- Issue date Oct 6, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Yoshinori Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interlayer insulating film
- Patent number 5,132,774
- Issue date Jul 21, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically programmable non-volatile memory device and manufactur...
- Patent number 5,101,250
- Issue date Mar 31, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Hideaki Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device with a planar interl...
- Patent number 5,077,238
- Issue date Dec 31, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Atsuhiro Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040232512
- Publication date Nov 25, 2004
- Renesas Technology Corp.
- Eiji Hasunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20040046215
- Publication date Mar 11, 2004
- EIJI HASUNUMA
- H01 - BASIC ELECTRIC ELEMENTS

Hideki Genjo

Person

Patents Grantslast 30 patents

Semiconductor device having interconnection structure

Semiconductor device having a metallic fuse member and cutting meth...

Method of manufacturing semiconductor device including interlaying...

Manufacturing method of an electrically programmable non-volatile m...

Semiconductor memory device having bit lines formed of an interconn...

Semiconductor device including interlayer insulating film

Electrically programmable non-volatile memory device and manufactur...

Method of manufacturing a semiconductor device with a planar interl...

Patents Applicationslast 30 patents

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF