Hideki Hagiwara

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Patents Grantslast 30 patents

Information Patent Grant
Copper plating bath and plating method for substrate using the copp...
- Patent number 6,800,188
- Issue date Oct 5, 2004
- Ebara-Udylite Co., Ltd.
- Hideki Hagiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via-filling process
- Patent number 6,518,182
- Issue date Feb 11, 2003
- Ebara-Udylite Co., Ltd.
- Masami Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Copper plating bath and plating method for substrate using the copp...
- Publication number 20030106802
- Publication date Jun 12, 2003
- Hideki Hagiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR