Hideki HIROTSURU

Person

Omuta-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Aluminum-silicon carbide composite and production method therefor
- Patent number 11,296,008
- Issue date Apr 5, 2022
- DENKA COMPANY LIMITED
- Takeshi Miyakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power module
- Patent number 11,094,648
- Issue date Aug 17, 2021
- DENKA COMPANY LIMITED
- Hideki Hirotsuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board
- Patent number 11,096,278
- Issue date Aug 17, 2021
- DENKA COMPANY LIMITED
- Atsushi Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure for electric circuit device
- Patent number 10,615,096
- Issue date Apr 7, 2020
- Denka Company Limited
- Toshitaka Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic resin composite body
- Patent number 10,487,013
- Issue date Nov 26, 2019
- DENKA COMPANY LIMITED
- Taiki Nishi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Resin-impregnated boron nitride sintered body and use for same
- Patent number 10,377,676
- Issue date Aug 13, 2019
- DENKA COMPANY LIMITED
- Koki Ikarashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Aluminium-silicon carbide composite, and power-module base plate
- Patent number 10,233,125
- Issue date Mar 19, 2019
- DENKA COMPANY LIMITED
- Daisuke Goto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Resin-impregnated boron nitride sintered body and use for same
- Patent number 10,087,112
- Issue date Oct 2, 2018
- Denka Company Limited
- Koki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite body and method for producing same
- Patent number 10,081,055
- Issue date Sep 25, 2018
- DENKA COMPANY LIMITED
- Takeshi Miyakawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing hexagonal boron nitride, and heat dissipation...
- Patent number 9,879,168
- Issue date Jan 30, 2018
- DENKA COMPANY LIMITED
- Junichi Tatami
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Heat dissipating component for semiconductor element
- Patent number 9,524,918
- Issue date Dec 20, 2016
- DENKA COMPANY LIMITED
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Boron nitride/resin composite circuit board, and circuit board incl...
- Patent number 9,516,741
- Issue date Dec 6, 2016
- Denka Company Limited
- Hideki Hirotsuru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate for LED light emitting element, method of produ...
- Patent number 9,387,532
- Issue date Jul 12, 2016
- DENKA COMPANY LIMITED
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Clad material for LED light-emitting element holding substrate, and...
- Patent number 9,299,888
- Issue date Mar 29, 2016
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-diamond composite and manufacturing method
- Patent number 9,017,824
- Issue date Apr 28, 2015
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wafer for LED mounting, method for manufacturing same, and LED-moun...
- Patent number 8,890,189
- Issue date Nov 18, 2014
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Substrate comprising aluminum/graphite composite, heat dissipation...
- Patent number 8,883,564
- Issue date Nov 11, 2014
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
LED chip assembly, LED package, and manufacturing method of LED pac...
- Patent number 8,546,842
- Issue date Oct 1, 2013
- Denki Kagaku Kogyo Kabushiki Kaisha
- Satoshi Higuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of aluminum-diamond composite
- Patent number 8,322,398
- Issue date Dec 4, 2012
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Aluminum-silicon carbide composite and heat dissipation device empl...
- Patent number 8,025,962
- Issue date Sep 27, 2011
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Aluminum/silicon carbide composite and radiating part comprising th...
- Patent number 7,993,728
- Issue date Aug 9, 2011
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Aluminum-silicon carbide composite
- Patent number 7,838,107
- Issue date Nov 23, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Goh Iwamoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for producing an integral ceramic circuit board
- Patent number 7,207,105
- Issue date Apr 24, 2007
- Denki Kagaku Kogyo Kabushiki Kaisha
- Akira Miyai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integral-type ceramic circuit board and method of producing same
- Patent number 7,130,174
- Issue date Oct 31, 2006
- Denki Kagaku Kogyo Kabushiki Kaisha
- Akira Miyai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide composite, method for producing it and heat dissipa...
- Patent number 6,447,894
- Issue date Sep 10, 2002
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Metal-ceramics composite, heat dissipation device employing it, and...
- Patent number 6,399,187
- Issue date Jun 4, 2002
- Denki Kagaku Kogyo Kabushiki Kaisha
- Ryuichi Terasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Superplastic silicon nitride sintered body
- Patent number 5,672,553
- Issue date Sep 30, 1997
- National Institute for Research in Inorganic Materials
- Mamoru Mitomo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Superplastic silicon carbide sintered body
- Patent number 5,591,685
- Issue date Jan 7, 1997
- National Institute for Research in Inorganic Materials
- Mamoru Mitomo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Silicon nitride powder, silicon nitride sintered body and processes...
- Patent number 5,126,295
- Issue date Jun 30, 1992
- Denki Kagaku Kogyo Kabushiki Kaisha
- Koichi Uchino
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC CIRCUIT BOARD
- Publication number 20200375029
- Publication date Nov 26, 2020
- DENKA COMPANY LIMITED
- Atsushi SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20200373251
- Publication date Nov 26, 2020
- DENKA COMPANY LIMITED
- Hideki HIROTSURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE FOR ELECTRIC CIRCUIT DEVICE
- Publication number 20190189534
- Publication date Jun 20, 2019
- DENKA COMPANY LIMITED
- Toshitaka YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC RESIN COMPOSITE BODY
- Publication number 20190092695
- Publication date Mar 28, 2019
- DENKA COMPANY LIMITED
- Taiki Nishi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COMPOSITE BODY AND METHOD FOR PRODUCING SAME
- Publication number 20170239715
- Publication date Aug 24, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ALUMINUM-SILICON CARBIDE COMPOSITE AND PRODUCTION METHOD THEREFOR
- Publication number 20170236767
- Publication date Aug 17, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
SILICON CARBIDE COMPLEX, METHOD FOR MANUFACTURING SAME, AND HEAT DI...
- Publication number 20170162469
- Publication date Jun 8, 2017
- DENKA COMPANY LIMITED
- Motonori KINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINIUM-SILICON CARBIDE COMPOSITE, AND POWER-MODULE BASE PLATE
- Publication number 20170107158
- Publication date Apr 20, 2017
- DENKA COMPANY LIMITED
- Daisuke GOTO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
RESIN-IMPREGNATED BORON NITRIDE SINTERED BODY AND USE FOR SAME
- Publication number 20170036963
- Publication date Feb 9, 2017
- DENKA COMPANY LIMITED
- Koki Ikarashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method for Producing Hexagonal Boron Nitride, and Heat Dissipation...
- Publication number 20160333246
- Publication date Nov 17, 2016
- DENKA COMPANY LIMITED
- Junichi Tatami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCL...
- Publication number 20160227644
- Publication date Aug 4, 2016
- Denka Company Limited
- Hideki HIROTSURU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN-IMPREGNATED BORON NITRIDE SINTERED BODY AND USE FOR SAME
- Publication number 20160130187
- Publication date May 12, 2016
- Denka Company Limited
- Koki Ikarashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CLAD MATERIAL FOR LED LIGHT-EMITTING ELEMENT HOLDING SUBSTRATE, AND...
- Publication number 20140339596
- Publication date Nov 20, 2014
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Yosuke Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT
- Publication number 20140182824
- Publication date Jul 3, 2014
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER FOR LED MOUNTING, METHOD FOR MANUFACTURING SAME, AND LED-MOUN...
- Publication number 20120168802
- Publication date Jul 5, 2012
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LED CHIP ASSEMBLY, LED PACKAGE, AND MANUFACTURING METHOD OF LED PAC...
- Publication number 20120112236
- Publication date May 10, 2012
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Satoshi Higuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING ALUMINUM/GRAPHITE COMPOSITE, HEAT DISSIPATION...
- Publication number 20110316038
- Publication date Dec 29, 2011
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SUBSTRATE FOR LED LIGHT EMITTING ELEMENT, METHOD OF PRODU...
- Publication number 20110316040
- Publication date Dec 29, 2011
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MANUFACTURING METHOD OF ALUMINUM-DIAMOND COMPOSITE
- Publication number 20110198771
- Publication date Aug 18, 2011
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM-DIAMOND COMPOSITE AND MANUFACTURING METHOD
- Publication number 20110123821
- Publication date May 26, 2011
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM/SILICON CARBIDE COMPOSITE AND HEAT RADIATION PART MAKING U...
- Publication number 20090280351
- Publication date Nov 12, 2009
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM/SILICON CARBIDE COMPOSITE AND RADIATING PART COMPRISING TH...
- Publication number 20090092793
- Publication date Apr 9, 2009
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING T...
- Publication number 20090075056
- Publication date Mar 19, 2009
- Denki Kagaku Kogyo Kabushiki Kaisha
- Goh Iwamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Aluminum-Silicon Carbide Composite
- Publication number 20070248829
- Publication date Oct 25, 2007
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Goh Iwamoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Integral ceramic circuit board and method for producing the same
- Publication number 20050167792
- Publication date Aug 4, 2005
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Akira Miyai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integral-type ceramic circuit board and method of producing same
- Publication number 20040038011
- Publication date Feb 26, 2004
- Akira Miyai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hideki HIROTSURU

Person

Patents Grantslast 30 patents

Aluminum-silicon carbide composite and production method therefor

Power module

Ceramic circuit board

Heat dissipation structure for electric circuit device

Ceramic resin composite body

Resin-impregnated boron nitride sintered body and use for same

Aluminium-silicon carbide composite, and power-module base plate

Resin-impregnated boron nitride sintered body and use for same

Composite body and method for producing same

Method for producing hexagonal boron nitride, and heat dissipation...

Heat dissipating component for semiconductor element

Boron nitride/resin composite circuit board, and circuit board incl...

Composite substrate for LED light emitting element, method of produ...

Clad material for LED light-emitting element holding substrate, and...

Aluminum-diamond composite and manufacturing method

Wafer for LED mounting, method for manufacturing same, and LED-moun...

Substrate comprising aluminum/graphite composite, heat dissipation...

LED chip assembly, LED package, and manufacturing method of LED pac...

Manufacturing method of aluminum-diamond composite

Aluminum-silicon carbide composite and heat dissipation device empl...

Aluminum/silicon carbide composite and radiating part comprising th...

Aluminum-silicon carbide composite

Method for producing an integral ceramic circuit board

Integral-type ceramic circuit board and method of producing same

Silicon carbide composite, method for producing it and heat dissipa...

Metal-ceramics composite, heat dissipation device employing it, and...

Superplastic silicon nitride sintered body

Superplastic silicon carbide sintered body

Silicon nitride powder, silicon nitride sintered body and processes...

Patents Applicationslast 30 patents

CERAMIC CIRCUIT BOARD

POWER MODULE

HEAT DISSIPATION STRUCTURE FOR ELECTRIC CIRCUIT DEVICE

CERAMIC RESIN COMPOSITE BODY

COMPOSITE BODY AND METHOD FOR PRODUCING SAME

ALUMINUM-SILICON CARBIDE COMPOSITE AND PRODUCTION METHOD THEREFOR

SILICON CARBIDE COMPLEX, METHOD FOR MANUFACTURING SAME, AND HEAT DI...

ALUMINIUM-SILICON CARBIDE COMPOSITE, AND POWER-MODULE BASE PLATE

RESIN-IMPREGNATED BORON NITRIDE SINTERED BODY AND USE FOR SAME

Method for Producing Hexagonal Boron Nitride, and Heat Dissipation...

BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCL...

RESIN-IMPREGNATED BORON NITRIDE SINTERED BODY AND USE FOR SAME

CLAD MATERIAL FOR LED LIGHT-EMITTING ELEMENT HOLDING SUBSTRATE, AND...

HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT

WAFER FOR LED MOUNTING, METHOD FOR MANUFACTURING SAME, AND LED-MOUN...

LED CHIP ASSEMBLY, LED PACKAGE, AND MANUFACTURING METHOD OF LED PAC...

SUBSTRATE COMPRISING ALUMINUM/GRAPHITE COMPOSITE, HEAT DISSIPATION...

COMPOSITE SUBSTRATE FOR LED LIGHT EMITTING ELEMENT, METHOD OF PRODU...

MANUFACTURING METHOD OF ALUMINUM-DIAMOND COMPOSITE

ALUMINUM-DIAMOND COMPOSITE AND MANUFACTURING METHOD

ALUMINUM/SILICON CARBIDE COMPOSITE AND HEAT RADIATION PART MAKING U...

ALUMINUM/SILICON CARBIDE COMPOSITE AND RADIATING PART COMPRISING TH...

ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING T...

Aluminum-Silicon Carbide Composite

Integral ceramic circuit board and method for producing the same

Integral-type ceramic circuit board and method of producing same