Hideki Ishii

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing process thereof
- Patent number 7,193,331
- Issue date Mar 20, 2007
- Renesas Technology Corp.
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 7,009,304
- Issue date Mar 7, 2006
- Renesas Technology Corp.
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,445,064
- Issue date Sep 3, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packed semiconductor device with wrap around external leads
- Patent number 5,835,988
- Issue date Nov 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced thickness semiconductor device with IC packages mounted in...
- Patent number 5,744,862
- Issue date Apr 28, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow mounting board
- Patent number 5,373,113
- Issue date Dec 13, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20070161129
- Publication date Jul 12, 2007
- Renesas Technology Corp.
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing process thereof
- Publication number 20050258531
- Publication date Nov 24, 2005
- Renesas Technology Corp.
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed semiconductor device
- Publication number 20050082689
- Publication date Apr 21, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed semiconductor device
- Publication number 20030201546
- Publication date Oct 30, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20020105091
- Publication date Aug 8, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Hideki Ishii

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing process thereof

Resin-sealed semiconductor device

Semiconductor device

Packed semiconductor device with wrap around external leads

Reduced thickness semiconductor device with IC packages mounted in...

Solder reflow mounting board

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

Semiconductor device and manufacturing process thereof

Resin-sealed semiconductor device

Resin-sealed semiconductor device

DUAL PACKAGE SEMICONDUCTOR DEVICE