Hideki Kawahara

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Kariya-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,288,767
- Issue date Apr 29, 2025
- Denso Corporation
- Hideki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,535,577
- Issue date Jan 14, 2020
- Denso Corporation
- Hiroshi Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module and driving device for switching element
- Patent number 9,373,570
- Issue date Jun 21, 2016
- Denso Corporation
- Hideki Kawahara
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
SiC semiconductor device with BPSG insulation film
- Patent number 8,212,261
- Issue date Jul 3, 2012
- Denso Corporation
- Hiroyuki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SiC semiconductor device
- Patent number 7,851,382
- Issue date Dec 14, 2010
- Denso Corporation
- Hiroki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192092
- Publication date Jun 12, 2025
- DENSO CORPORATION
- Hideki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220415843
- Publication date Dec 29, 2022
- DENSO CORPORATION
- Hideki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190088568
- Publication date Mar 21, 2019
- Denso Corporation
- Hiroshi ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR MODULE AND DRIVING DEVICE FOR SWITCHING ELEMENT
- Publication number 20140346635
- Publication date Nov 27, 2014
- DENSO CORPORATION
- Hideki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC semiconductor device with BPSG insulation film and method for m...
- Publication number 20080315211
- Publication date Dec 25, 2008
- DENSO CORPORATION
- Hiroyuki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing sic semiconductor device
- Publication number 20080318438
- Publication date Dec 25, 2008
- DENSO CORPORATION
- Hiroki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS