Hideki Kitada

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Switch element and method for manufacturing switch element
- Patent number 11,195,577
- Issue date Dec 7, 2021
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus, fabrication method therefor and electronic part
- Patent number 10,383,229
- Issue date Aug 13, 2019
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 10,319,667
- Issue date Jun 11, 2019
- Fujitsu Limited
- Shoichi Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,008,436
- Issue date Jun 26, 2018
- Fujitsu Limited
- Aki Dote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second semiconductor substrates
- Patent number 9,202,752
- Issue date Dec 1, 2015
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper wiring with increased migration...
- Patent number 8,836,122
- Issue date Sep 16, 2014
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device having improved copper...
- Patent number 8,383,509
- Issue date Feb 26, 2013
- Fujitsu Semiconductor Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing same, and apparatus f...
- Patent number 8,319,277
- Issue date Nov 27, 2012
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device suitable for forming w...
- Patent number 8,071,474
- Issue date Dec 6, 2011
- Fujitsu Semiconductor Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper wiring
- Patent number 7,871,924
- Issue date Jan 18, 2011
- Fujitsu Semiconductor Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,868,456
- Issue date Jan 11, 2011
- Fujitsu Limited
- Takashi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacture method for semiconductor device suitable for forming wi...
- Patent number 7,846,833
- Issue date Dec 7, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device suitable for forming w...
- Patent number 7,795,141
- Issue date Sep 14, 2010
- Fujitsu Semiconductor Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device suitable for forming wi...
- Patent number 7,713,869
- Issue date May 11, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing same, and apparatus f...
- Patent number 7,670,925
- Issue date Mar 2, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device having improved copper...
- Patent number 7,611,984
- Issue date Nov 3, 2009
- Fujitsu Microelectronics Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device having concave portions...
- Patent number 7,507,666
- Issue date Mar 24, 2009
- Fujitsu Microelectronics Limited
- Yoshiyuki Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer interconnection structure...
- Patent number 7,416,985
- Issue date Aug 26, 2008
- Fujitsu Limited
- Tamotsu Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device suitable for forming w...
- Patent number 7,413,977
- Issue date Aug 19, 2008
- Fujitsu Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,329,952
- Issue date Feb 12, 2008
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 7,279,790
- Issue date Oct 9, 2007
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper wiring
- Patent number 7,205,667
- Issue date Apr 17, 2007
- Fujitsu Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wiring and semiconductor device ma...
- Patent number 6,242,808
- Issue date Jun 5, 2001
- Fujitsu Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SWITCH ELEMENT AND METHOD FOR MANUFACTURING SWITCH ELEMENT
- Publication number 20210151104
- Publication date May 20, 2021
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20190192036
- Publication date Jun 27, 2019
- Fujitsu Limited
- Taiji Sakai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC APPARATUS, FABRICATION METHOD THEREFOR AND ELECTRONIC PART
- Publication number 20180279476
- Publication date Sep 27, 2018
- Fujitsu Limited
- Taiki UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND STAC...
- Publication number 20180174906
- Publication date Jun 21, 2018
- Fujitsu Limited
- Hiroko Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180061740
- Publication date Mar 1, 2018
- Fujitsu Limited
- Shoichi Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180012999
- Publication date Jan 11, 2018
- Fujitsu Limited
- Hiroko Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20170110369
- Publication date Apr 20, 2017
- Fujitsu Limited
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20160351474
- Publication date Dec 1, 2016
- Fujitsu Limited
- Aki Dote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20160351499
- Publication date Dec 1, 2016
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20130093092
- Publication date Apr 18, 2013
- Fujitsu Limited
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...
- Publication number 20110151662
- Publication date Jun 23, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING COPPER WIRING WITH INCREASED MIGRATION...
- Publication number 20110062589
- Publication date Mar 17, 2011
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUITABLE FOR FORMING W...
- Publication number 20100323519
- Publication date Dec 23, 2010
- FUJITSU SEMICONDUCTOR LIMITED
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100244201
- Publication date Sep 30, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE SUITABLE FOR FORMING WI...
- Publication number 20100178762
- Publication date Jul 15, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND APPARATUS F...
- Publication number 20100123480
- Publication date May 20, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...
- Publication number 20100007023
- Publication date Jan 14, 2010
- Fujitsu Microelectronics Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device suitable for forming w...
- Publication number 20080286960
- Publication date Nov 20, 2008
- Fujitsu Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20080211098
- Publication date Sep 4, 2008
- Fujitsu Limited
- Takashi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND APPARATUS F...
- Publication number 20080150586
- Publication date Jun 26, 2008
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having copper wiring
- Publication number 20070161242
- Publication date Jul 12, 2007
- FUJITSU LIMITED
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacture method
- Publication number 20070048931
- Publication date Mar 1, 2007
- FUJITSU LIMITED
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device having concave portions...
- Publication number 20070049024
- Publication date Mar 1, 2007
- FUJITSU LIMITED
- Yoshiyuki Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device suitable for forming wi...
- Publication number 20070045851
- Publication date Mar 1, 2007
- FUJITSU LIMITED
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device having improved copper...
- Publication number 20070020931
- Publication date Jan 25, 2007
- FUJITSU LIMITED
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having copper wiring and its manufacture method
- Publication number 20060012046
- Publication date Jan 19, 2006
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050233564
- Publication date Oct 20, 2005
- FUJITSU LIMITED
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multilayer interconnection structure...
- Publication number 20050212137
- Publication date Sep 29, 2005
- FUJITSU LIMITED
- Tamotsu Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a manufacturing method thereof
- Publication number 20030042610
- Publication date Mar 6, 2003
- Fujitsu Limited,
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS

Hideki Kitada

Person

Patents Grantslast 30 patents

Switch element and method for manufacturing switch element

Electronic apparatus, fabrication method therefor and electronic part

Electronic device and method of fabricating the same

Semiconductor device

Semiconductor device with first and second semiconductor substrates

Semiconductor device having copper wiring with increased migration...

Manufacture method for semiconductor device having improved copper...

Semiconductor device, method of manufacturing same, and apparatus f...

Method of manufacturing semiconductor device suitable for forming w...

Semiconductor device having copper wiring

Semiconductor device and method for fabricating the same

Manufacture method for semiconductor device suitable for forming wi...

Method of manufacturing semiconductor device suitable for forming w...

Manufacture method for semiconductor device suitable for forming wi...

Semiconductor device, method of manufacturing same, and apparatus f...

Manufacture method for semiconductor device having improved copper...

Manufacture method for semiconductor device having concave portions...

Semiconductor device having a multilayer interconnection structure...

Method of manufacturing semiconductor device suitable for forming w...

Method of fabricating a semiconductor device

Semiconductor device and a manufacturing method thereof

Semiconductor device having copper wiring

Semiconductor device with copper wiring and semiconductor device ma...

Patents Applicationslast 30 patents

SWITCH ELEMENT AND METHOD FOR MANUFACTURING SWITCH ELEMENT

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC APPARATUS, FABRICATION METHOD THEREFOR AND ELECTRONIC PART

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND STAC...

ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...

SEMICONDUCTOR DEVICE HAVING COPPER WIRING WITH INCREASED MIGRATION...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUITABLE FOR FORMING W...

SEMICONDUCTOR DEVICE

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE SUITABLE FOR FORMING WI...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND APPARATUS F...

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...

Method of manufacturing semiconductor device suitable for forming w...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND APPARATUS F...

Semiconductor device having copper wiring

Semiconductor device and its manufacture method

Manufacture method for semiconductor device having concave portions...

Manufacture method for semiconductor device suitable for forming wi...

Manufacture method for semiconductor device having improved copper...

Semiconductor device having copper wiring and its manufacture method

Semiconductor device and method for fabricating the same

Semiconductor device having a multilayer interconnection structure...

Semiconductor device and a manufacturing method thereof