Hideki Matsuhashi

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San Jose, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Multiple copper vias for integrated circuit metallization
- Patent number 7,078,817
- Issue date Jul 18, 2006
- Board of Regents, The University of Texas System
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple copper vias for integrated circuit metallization and metho...
- Patent number 6,919,639
- Issue date Jul 19, 2005
- The Board of Regents, The University of Texas System
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multiple copper vias for integrated circuit metallization
- Publication number 20050093163
- Publication date May 5, 2005
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple copper vias for integrated circuit metallization and metho...
- Publication number 20040070078
- Publication date Apr 15, 2004
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS