Hideki Matsui

Follow

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board
- Patent number 12,369,247
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Hideki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave blocking material and electromagnetic wave blo...
- Patent number 6,855,883
- Issue date Feb 15, 2005
- Kazu Investment Co., Ltd.
- Hideki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230380058
- Publication date Nov 23, 2023
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR