Hideki Mizuno

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin sealing apparatus and resin sealing method
- Patent number 6,576,178
- Issue date Jun 10, 2003
- NEC Compound Semiconductor Devices, Ltd.
- Hideki Mizuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device, lead frame, and lead bonding
- Patent number 6,084,310
- Issue date Jul 4, 2000
- NEC Corporation
- Hideki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming chip semiconductor devices
- Patent number 6,077,757
- Issue date Jun 20, 2000
- NEC Corporation
- Hideki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for face-down bonding
- Patent number 6,018,189
- Issue date Jan 25, 2000
- NEC Corporation
- Hideki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Resin sealing apparatus and resin sealing method
- Publication number 20010004923
- Publication date Jun 28, 2001
- Hideki Mizuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL