Hideki Mukuno

Person

  • Hitachiota, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic device

    • Patent number 6,774,490
    • Issue date Aug 10, 2004
    • Hitachi, Ltd.
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering machine

    • Patent number 6,761,301
    • Issue date Jul 13, 2004
    • Hitachi, Ltd.
    • Hideki Mukuno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electron device and semiconductor device

    • Patent number 6,555,052
    • Issue date Apr 29, 2003
    • Hitachi, Ltd.
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bump forming method and bump forming apparatus

    • Patent number 6,541,364
    • Issue date Apr 1, 2003
    • Hitachi, Ltd.
    • Hideki Mukuno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering machine

    • Patent number 6,412,681
    • Issue date Jul 2, 2002
    • Hitachi, Ltd.
    • Hideki Mukuno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SOLDERING METHOD

    • Publication number 20070051777
    • Publication date Mar 8, 2007
    • TAMURA CORPORATION
    • Takahito Yamaguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electron device and semiconductor device

    • Publication number 20030186072
    • Publication date Oct 2, 2003
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Soldering machine

    • Publication number 20020100791
    • Publication date Aug 1, 2002
    • Hitachi, Ltd.
    • Hideki Mukuno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electron device and semiconductor device

    • Publication number 20020066583
    • Publication date Jun 6, 2002
    • Tasao Soga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump forming method and bump forming apparatus

    • Publication number 20020058406
    • Publication date May 16, 2002
    • Hideki Mukuno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Soldering machine

    • Publication number 20010015368
    • Publication date Aug 23, 2001
    • Hideki Mukuno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR