Hideki Niimi

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for producing the same
- Patent number 11,134,561
- Issue date Sep 28, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor package in a wiring board...
- Patent number 10,679,920
- Issue date Jun 9, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mounting substrate and method for manufacturing the same
- Patent number 8,217,515
- Issue date Jul 10, 2012
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor mounting substrate and method for manufacturing the same
- Patent number 7,919,359
- Issue date Apr 5, 2011
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240213207
- Publication date Jun 27, 2024
- Panasonic Holdings Corporation
- Masato MAEDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20200314996
- Publication date Oct 1, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hideki NIIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190229029
- Publication date Jul 25, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEKI NIIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140110153
- Publication date Apr 24, 2014
- PANASONIC CORPORATION
- Takafumi Kashiwagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110140270
- Publication date Jun 16, 2011
- Junichi KIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080093739
- Publication date Apr 24, 2008
- Junichi KIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hideki Niimi

Person

Patents Grantslast 30 patents

Wiring board and method for producing the same

Semiconductor device having semiconductor package in a wiring board...

Semiconductor mounting substrate and method for manufacturing the same

Semiconductor mounting substrate and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

WIRING BOARD AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME