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Hideki Numazawa
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Urawa-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Ultraviolet-curable pressure sensitive adhesive composition and ult...
Patent number
6,605,345
Issue date
Aug 12, 2003
Lintec Corporation
Michio Kanai
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Pressure sensitive adhesive sheet for wafer sticking
Patent number
6,524,700
Issue date
Feb 25, 2003
NEC Corporation
Yasushi Masuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for producing chip and pressure sensitive adhesive sheet fo...
Patent number
6,225,194
Issue date
May 1, 2001
Lintec Corporation
Hayato Noguchi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Process for producing chip and pressure sensitive adhesive sheet fo...
Patent number
5,976,691
Issue date
Nov 2, 1999
Lintec Corporation
Hayato Noguchi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Pressure sensitive adhesive composition and sheet having layer thereof
Patent number
5,955,512
Issue date
Sep 21, 1999
Lintec Corporation
Hideki Numazawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
Ultraviolet-curable pressure sensitive adhesive composition and ult...
Publication number
20020019454
Publication date
Feb 14, 2002
LINTEC CORPORATION
Michio Kanai
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Pressure sensitive adhesive sheet for wafer sticking
Publication number
20010019766
Publication date
Sep 6, 2001
NEC CORPORATION and LINTEC CORPORATION
Yasushi Masuda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...