Hideki Oura

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing apparatus
- Patent number 6,416,618
- Issue date Jul 9, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masaaki Tsuchihashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20020002950
- Publication date Jan 10, 2002
- MASAAKI TSUCHIHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...