Hideki Sakoda

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame and resin-encapsulated semiconductor device
- Patent number 7,728,414
- Issue date Jun 1, 2010
- Panasonic Corporation
- Kouji Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High heat release semiconductor and method for manufacturing the same
- Patent number 7,508,055
- Issue date Mar 24, 2009
- Panasonic Corporation
- Yutaka Katou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead frame and resin-encapsulated semiconductor device
- Publication number 20060255438
- Publication date Nov 16, 2006
- Kouji Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050253280
- Publication date Nov 17, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yutaka Katou
- H01 - BASIC ELECTRIC ELEMENTS