Membership
Tour
Register
Log in
Hideki Sekine
Follow
Person
Sendai, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Element splitting method, element splitting arithmetic device and d...
Patent number
7,991,215
Issue date
Aug 2, 2011
Fuji Jukogyo Kabushiki Kaisha
Tomonaga Okabe
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Bonded part peeling shape identification device
Patent number
7,522,269
Issue date
Apr 21, 2009
Fuji Jukogyo Kabushiki Kaisha
Toshimichi Ogisu
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
Bonded part peeling shape identification device
Publication number
20080008385
Publication date
Jan 10, 2008
Toshimichi Ogisu
G01 - MEASURING TESTING
Information
Patent Application
Element splitting method, element splitting arithmetic device and d...
Publication number
20070292016
Publication date
Dec 20, 2007
Tomonaga Okabe
G06 - COMPUTING CALCULATING COUNTING