Hideki TAKAGI

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite having diamond crystal base
- Patent number 12,027,440
- Issue date Jul 2, 2024
- National Institute of Advanced Industrial Science and Technology
- Takashi Matsumae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device manufactured by room-temperature bonding, device manufacturi...
- Patent number 10,112,376
- Issue date Oct 30, 2018
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL, CO., LTD.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light emitting element and method for producing the same
- Patent number 9,929,311
- Issue date Mar 27, 2018
- Marubun Corporation
- Yukio Kashima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for semiconductor substrate
- Patent number 9,761,479
- Issue date Sep 12, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Ko Imaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package formation method and MEMS package
- Patent number 9,751,754
- Issue date Sep 5, 2017
- National Institute of Advanced Industrial Science and Technology
- Yuuichi Kurashima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature bonding apparatus and room temperature bonding method
- Patent number 9,580,306
- Issue date Feb 28, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting element and method for manufacturing same
- Patent number 9,349,918
- Issue date May 24, 2016
- Marubun Corporation
- Yukio Kashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, field-effect transistor, integrated circui...
- Patent number 9,112,035
- Issue date Aug 18, 2015
- Sumitomo Chemical Company, Limited
- Hisashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufcaturing method for room-temperature substrate bonding
- Patent number 8,936,998
- Issue date Jan 20, 2015
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room-temperature bonding method and room-temperature bonding appara...
- Patent number 8,608,048
- Issue date Dec 17, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding using sputtering
- Patent number 8,602,289
- Issue date Dec 10, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of molding glass parts and molding apparatus
- Patent number 8,099,982
- Issue date Jan 24, 2012
- National Institute of Advanced Industrial Science and Technology
- Hideki Takagi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and manufacturing surface acoustic wave device
- Patent number 7,331,092
- Issue date Feb 19, 2008
- Fujitsu Media Devices Limited
- Michio Miura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming film of ultrafine particles
- Patent number 6,280,802
- Issue date Aug 28, 2001
- Agency of Industrial Science and Technology Ministry of International Trade a...
- Jun Akedo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for assembling piping or components by TIG welding
- Patent number 5,396,039
- Issue date Mar 7, 1995
- L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Ge...
- Henri Chevrel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PLASMA SOURCE, AND ATOMIC CLOCK EMPLOYING PLASMA SOURCE
- Publication number 20240276626
- Publication date Aug 15, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yuuichi KURASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...
- Publication number 20240258195
- Publication date Aug 1, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Hideaki YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING...
- Publication number 20240149565
- Publication date May 9, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Takashi MATSUMAE
- B32 - LAYERED PRODUCTS
Information Patent Application
DIAMOND COMPOSITE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230170276
- Publication date Jun 1, 2023
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCINCE AND TECHNOLOGY
- Takashi MATSUMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE HAVING DIAMOND CRYSTAL BASE
- Publication number 20220230934
- Publication date Jul 21, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Takashi MATSUMAE
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE JOINING METHOD
- Publication number 20190172813
- Publication date Jun 6, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FORMATION METHOD AND MEMS PACKAGE
- Publication number 20160332870
- Publication date Nov 17, 2016
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yuuichi KURASHIMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MICROPATTERN OF POLYIMIDE USING IMPRINTING
- Publication number 20160263814
- Publication date Sep 15, 2016
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sung Won YOUN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...
- Publication number 20160250838
- Publication date Sep 1, 2016
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20160204023
- Publication date Jul 14, 2016
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Ko IMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20160042102
- Publication date Feb 11, 2016
- Yukio KASHIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20150251904
- Publication date Sep 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PRODUCING COMPOSITE WAFER AND COMPOSITE WAFER
- Publication number 20150155165
- Publication date Jun 4, 2015
- Sumitomo Chemical Company, Limited
- Masahiko HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20140167066
- Publication date Jun 19, 2014
- MARUBUN CORPORATION
- Yukio Kashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20130213561
- Publication date Aug 22, 2013
- Jun UTSUMI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
MICROMECHANICAL SYSTEM
- Publication number 20130115433
- Publication date May 9, 2013
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Kazuma KURIHARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SUBSTRATE, FIELD-EFFECT TRANSISTOR, INTEGRATED CIRCUI...
- Publication number 20120205747
- Publication date Aug 16, 2012
- THE UNIVERSITY OF TOKYO
- Hisashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20110214816
- Publication date Sep 8, 2011
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20100276723
- Publication date Nov 4, 2010
- MITSUBUISHI HEAVY INDUSTRIES, LTD.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOLDING GLASS PARTS, MOLDING APPARATUS, AND MOLDED PRODUC...
- Publication number 20100112341
- Publication date May 6, 2010
- Hideki Takagi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...
- Publication number 20100092786
- Publication date Apr 15, 2010
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20100000663
- Publication date Jan 7, 2010
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and manufacturing surface acoustic wave device
- Publication number 20040226162
- Publication date Nov 18, 2004
- FUJITSU MEDIA DEVICES LIMITED
- Michio Miura
- H03 - BASIC ELECTRONIC CIRCUITRY

Hideki TAKAGI

Person

Patents Grantslast 30 patents

Composite having diamond crystal base

Device manufactured by room-temperature bonding, device manufacturi...

Semiconductor light emitting element and method for producing the same

Manufacturing method for semiconductor substrate

Package formation method and MEMS package

Room temperature bonding apparatus and room temperature bonding method

Light emitting element and method for manufacturing same

Semiconductor substrate, field-effect transistor, integrated circui...

Manufcaturing method for room-temperature substrate bonding

Room-temperature bonding method and room-temperature bonding appara...

Room temperature bonding using sputtering

Method of molding glass parts and molding apparatus

Method and manufacturing surface acoustic wave device

Method of forming film of ultrafine particles

Process for assembling piping or components by TIG welding

Patents Applicationslast 30 patents

PLASMA SOURCE, AND ATOMIC CLOCK EMPLOYING PLASMA SOURCE

BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...

COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING...

DIAMOND COMPOSITE AND METHOD OF MANUFACTURING THE SAME

COMPOSITE HAVING DIAMOND CRYSTAL BASE

SUBSTRATE JOINING METHOD

PACKAGE FORMATION METHOD AND MEMS PACKAGE

METHOD FOR FORMING MICROPATTERN OF POLYIMIDE USING IMPRINTING

DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...

MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR PRODUCING THE SAME

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

METHOD OF PRODUCING COMPOSITE WAFER AND COMPOSITE WAFER

LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME

DEVICE AND DEVICE MANUFACTURE METHOD

MICROMECHANICAL SYSTEM

SEMICONDUCTOR SUBSTRATE, FIELD-EFFECT TRANSISTOR, INTEGRATED CIRCUI...

ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS

DEVICE AND DEVICE MANUFACTURE METHOD

METHOD OF MOLDING GLASS PARTS, MOLDING APPARATUS, AND MOLDED PRODUC...

DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...

ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS

Method and manufacturing surface acoustic wave device