Hideki Takayanagi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Device for measuring bump height, apparatus for processing substrat...
- Patent number 11,604,150
- Issue date Mar 14, 2023
- Ebara Corporation
- Takahisa Okuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,535,949
- Issue date Dec 27, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of removing liquid from seal of a substrate holder
- Patent number 11,230,789
- Issue date Jan 25, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR MEASURING BUMP HEIGHT, APPARATUS FOR PROCESSING SUBSTRAT...
- Publication number 20210285893
- Publication date Sep 16, 2021
- EBARA CORPORATION
- Takahisa Okuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING LIQUID FROM SEAL OF A SUBSTRATE HOLDER
- Publication number 20200199769
- Publication date Jun 25, 2020
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20190390359
- Publication date Dec 26, 2019
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR