Hideki Tateishi

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming metal film
- Patent number 8,357,284
- Issue date Jan 22, 2013
- Ebara Corporation
- Akira Susaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for surface treatment of substrate, and substr...
- Patent number 8,205,625
- Issue date Jun 26, 2012
- Ebara Corporation
- Hideki Tateishi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and apparatus fabrication process of a...
- Patent number 7,709,394
- Issue date May 4, 2010
- Tokyo Electron Limited
- Hidenori Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING METAL FILM
- Publication number 20110155581
- Publication date Jun 30, 2011
- Akira SUSAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Film Thickness Measuring Method and Substrate Processing Apparatus
- Publication number 20100097607
- Publication date Apr 22, 2010
- Akira Susaki
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND APPARATUS, METHOD FOR MANUFACTURING...
- Publication number 20090204252
- Publication date Aug 13, 2009
- TOKYO ELECTRON LIMITED
- Hidenori MIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for surface treatment of substrate, and substr...
- Publication number 20080124932
- Publication date May 29, 2008
- Hideki Tateishi
- B24 - GRINDING POLISHING
Information Patent Application
Substrate Processing Apparatus
- Publication number 20070289604
- Publication date Dec 20, 2007
- Yukio Fukunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND APPARATUS FABRICATION PROCESS OF A...
- Publication number 20070224725
- Publication date Sep 27, 2007
- TOKYO ELECTRON LIMITED
- Hidenori MIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20060118598
- Publication date Jun 8, 2006
- EBARA CORPORATION
- Yusuke Chikamori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hideki Tateishi

Person

Patents Grantslast 30 patents

Method for forming metal film

Apparatus and method for surface treatment of substrate, and substr...

Substrate processing method and apparatus fabrication process of a...

Patents Applicationslast 30 patents

METHOD FOR FORMING METAL FILM

Film Thickness Measuring Method and Substrate Processing Apparatus

SUBSTRATE PROCESSING METHOD AND APPARATUS, METHOD FOR MANUFACTURING...

Apparatus and method for surface treatment of substrate, and substr...

Substrate Processing Apparatus

SUBSTRATE PROCESSING METHOD AND APPARATUS FABRICATION PROCESS OF A...

Bonding apparatus and bonding method