Hideki TERASAWA

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Kariya-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus including semiconductor package
- Patent number 11,691,869
- Issue date Jul 4, 2023
- Denso Corporation
- Suguru Hochi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vehicle position attitude calculation apparatus and vehicle positio...
- Patent number 11,066,078
- Issue date Jul 20, 2021
- Denso Corporation
- Hideki Terasawa
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS INCLUDING SEMICONDUCTOR PACKAGE
- Publication number 20220081283
- Publication date Mar 17, 2022
- DENSO CORPORATION
- Suguru HOCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VEHICLE POSITION ATTITUDE CALCULATION APPARATUS AND VEHICLE POSITIO...
- Publication number 20190185016
- Publication date Jun 20, 2019
- Denso Corporation
- Hideki TERASAWA
- B60 - VEHICLES IN GENERAL