Hideki Tokuyama

Follow

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Patent number 7,056,770
- Issue date Jun 6, 2006
- Towa Corporation
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Publication number 20040101631
- Publication date May 27, 2004
- TOWA CORPORATION
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS