Hideki Toya

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin for semiconductor wire
- Patent number 6,700,198
- Issue date Mar 2, 2004
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing the same
- Patent number 6,664,133
- Issue date Dec 16, 2003
- Shinko Electric Industries Co., Ltd.
- Akinobu Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate for producing semiconductor device
- Patent number 6,348,416
- Issue date Feb 19, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead frame and method of manufacturing the same
- Publication number 20030067058
- Publication date Apr 10, 2003
- Shinko Electric Industries Co., Ltd.
- Akinobu Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin for semiconductor wire
- Publication number 20020019133
- Publication date Feb 14, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS