Hideki Watanabe

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Patents Grantslast 30 patents

Information Patent Grant
Surface mounting structure
- Patent number 5,926,375
- Issue date Jul 20, 1999
- Hitachi, Ltd.
- Hideki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip module with heat sink and attachment means
- Patent number 5,844,311
- Issue date Dec 1, 1998
- Hitachi, Ltd.
- Hideki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device provided with a ceramic substrate having...
- Patent number 5,249,100
- Issue date Sep 28, 1993
- Hitachi, Ltd.
- Ryohei Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for airtightly packaging semiconductor package
- Patent number 4,836,434
- Issue date Jun 6, 1989
- Hitachi, Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 4,706,165
- Issue date Nov 10, 1987
- Hitachi Microcomputer Engineering Co., Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS