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Hideki Yoshino
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Bonding process with rotating bonding stage
Patent number
11,273,515
Issue date
Mar 15, 2022
KAIJO CORPORATION
Yuji Komagino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus with rotating bonding stage
Patent number
11,173,567
Issue date
Nov 16, 2021
KAIJO CORPORATION
Yuji Komagino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Work clamp and wire bonding apparatus
Patent number
7,975,899
Issue date
Jul 12, 2011
Kaijo Corporation
Riki Jindo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
Publication number
20200238433
Publication date
Jul 30, 2020
KAIJO CORPORATION
Yuji KOMAGINO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
Publication number
20180326531
Publication date
Nov 15, 2018
KAIJO CORPORATION
Yuji KOMAGINO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Work Clamp and Wire Bonding Apparatus
Publication number
20090134201
Publication date
May 28, 2009
Riki Jindo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR