Hideki Yuzawa

Person

Iida-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip and semiconductor device, and method for manufac...
- Patent number 8,338,965
- Issue date Dec 25, 2012
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device, and method for manufac...
- Patent number 7,872,358
- Issue date Jan 18, 2011
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device, and method for manufac...
- Patent number 7,786,598
- Issue date Aug 31, 2010
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer examination method and semiconductor chip manuf...
- Patent number 7,598,730
- Issue date Oct 6, 2009
- Seiko Epson Corporation
- Hideki Yuzawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer examination method and semiconductor chip manuf...
- Patent number 7,573,256
- Issue date Aug 11, 2009
- Seiko Epson Corporation
- Hideki Yuzawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device that improves electrical connection reliability
- Patent number 7,560,814
- Issue date Jul 14, 2009
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device, and method for manufac...
- Patent number 7,525,200
- Issue date Apr 28, 2009
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device, and methods for manufac...
- Patent number 7,279,794
- Issue date Oct 9, 2007
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that improves electrical connection reliability
- Patent number 7,230,338
- Issue date Jun 12, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, electronic device and electronic equipment, a...
- Patent number 7,208,840
- Issue date Apr 24, 2007
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device, and method for manufac...
- Patent number 7,154,187
- Issue date Dec 26, 2006
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, including differently...
- Patent number 7,144,758
- Issue date Dec 5, 2006
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of fabricating tape-like wiring substrate
- Patent number 7,081,590
- Issue date Jul 25, 2006
- Seiko Epson Corporation
- Hideki Yuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 6,905,915
- Issue date Jun 14, 2005
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, method of manufacturing the same, electronic componen...
- Patent number 6,731,511
- Issue date May 4, 2004
- Seiko Epson Corporation
- Hideki Yuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of fabrication thereof, circuit boa...
- Patent number 6,551,918
- Issue date Apr 22, 2003
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabrication thereof, circuit boa...
- Patent number 6,335,568
- Issue date Jan 1, 2002
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and transferring conductor patterns to a film carrier, and m...
- Patent number 6,040,093
- Issue date Mar 21, 2000
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20110079915
- Publication date Apr 7, 2011
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20100289153
- Publication date Nov 18, 2010
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20090174085
- Publication date Jul 9, 2009
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20090035929
- Publication date Feb 5, 2009
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...
- Publication number 20070259458
- Publication date Nov 8, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...
- Publication number 20070259459
- Publication date Nov 8, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...
- Publication number 20070259460
- Publication date Nov 8, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...
- Publication number 20070259461
- Publication date Nov 8, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...
- Publication number 20070254388
- Publication date Nov 1, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device that improves electrical connection reliability
- Publication number 20070228560
- Publication date Oct 4, 2007
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20070069242
- Publication date Mar 29, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...
- Publication number 20070018675
- Publication date Jan 25, 2007
- SEIKO EPSON CORPORATION
- Hideki YUZAWA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device, circuit board, and electronic instrument
- Publication number 20050269697
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050272243
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and semiconductor device, and method for manufac...
- Publication number 20050139983
- Publication date Jun 30, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and electronic device, and methods for manufac...
- Publication number 20050127493
- Publication date Jun 16, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and electronic device, as well as method for m...
- Publication number 20050127522
- Publication date Jun 16, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, semiconductor module, electronic device and e...
- Publication number 20050012224
- Publication date Jan 20, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor manufacturing apparatus, and method for manufacturing...
- Publication number 20050011068
- Publication date Jan 20, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device, manufacturing method...
- Publication number 20050009240
- Publication date Jan 13, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module, electronic device and electronic equipment, a...
- Publication number 20050009219
- Publication date Jan 13, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof, electronic devi...
- Publication number 20050006791
- Publication date Jan 13, 2005
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, and elec...
- Publication number 20030219926
- Publication date Nov 27, 2003
- Seiko Epson Corporation
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method of fabricating tape-like wiring substrate
- Publication number 20030174483
- Publication date Sep 18, 2003
- Seiko Epson Corporation
- Hideki Yuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method of manufacturing the same, electronic componen...
- Publication number 20030161120
- Publication date Aug 28, 2003
- Seiko Epson Corporation
- Hideki Yuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and method of fabricating the same, semiconductor devi...
- Publication number 20030159282
- Publication date Aug 28, 2003
- Seiko Epson Corporation
- Hideki Yuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, method of manufacturing the same, manufacturi...
- Publication number 20030145947
- Publication date Aug 7, 2003
- Seiko Epson Corporation
- Michiyoshi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of fabrication thereof, circuit boa...
- Publication number 20020072214
- Publication date Jun 13, 2002
- SEIKO EPSON CORPORATION
- Hideki Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS

Hideki Yuzawa

Person

Patents Grantslast 30 patents

Semiconductor chip and semiconductor device, and method for manufac...

Semiconductor chip and semiconductor device, and method for manufac...

Semiconductor chip and semiconductor device, and method for manufac...

Semiconductor wafer examination method and semiconductor chip manuf...

Semiconductor wafer examination method and semiconductor chip manuf...

Semiconductor device that improves electrical connection reliability

Semiconductor chip and semiconductor device, and method for manufac...

Semiconductor device and electronic device, and methods for manufac...

Semiconductor device that improves electrical connection reliability

Semiconductor module, electronic device and electronic equipment, a...

Semiconductor chip and semiconductor device, and method for manufac...

Manufacturing method of semiconductor device, including differently...

Wiring board and method of fabricating tape-like wiring substrate

Semiconductor device and method of manufacturing the same, and elec...

Wiring board, method of manufacturing the same, electronic componen...

Semiconductor device and method of fabrication thereof, circuit boa...

Semiconductor device and method of fabrication thereof, circuit boa...

Method and transferring conductor patterns to a film carrier, and m...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

Method of manufacturing semiconductor device

SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...

SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...

SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...

SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...

SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...

Semiconductor device that improves electrical connection reliability

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR WAFER EXAMINATION METHOD AND SEMICONDUCTOR CHIP MANUF...

Semiconductor device, circuit board, and electronic instrument

Method of manufacturing semiconductor device

Semiconductor chip and semiconductor device, and method for manufac...

Semiconductor device and electronic device, and methods for manufac...

Semiconductor device and electronic device, as well as method for m...

Semiconductor device, semiconductor module, electronic device and e...

Semiconductor manufacturing apparatus, and method for manufacturing...

Manufacturing method of semiconductor device, manufacturing method...

Semiconductor module, electronic device and electronic equipment, a...

Semiconductor device, manufacturing method thereof, electronic devi...

Semiconductor device and method of manufacturing the same, and elec...

Wiring board and method of fabricating tape-like wiring substrate

Wiring board, method of manufacturing the same, electronic componen...

Wiring board and method of fabricating the same, semiconductor devi...

Semiconductor device, method of manufacturing the same, manufacturi...

Semiconductor device and method of fabrication thereof, circuit boa...