Hidekiyo Takaoka

Person

Omihachiman-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Repair method and repair material
- Patent number 10,994,366
- Issue date May 4, 2021
- Murata Manufacturing Co., Ltd.
- Satoshi Ishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for joining structural material, joining sheet, and joint st...
- Patent number 10,413,992
- Issue date Sep 17, 2019
- MURATA MANUFACTURING CO., LTD.
- Satoshi Ishino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bump, and solder bump
- Patent number 10,090,268
- Issue date Oct 2, 2018
- MURATA MANUFACTURING CO., LTD.
- Yasuyuki Sekimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, bonding method using the same, and bonded stru...
- Patent number 10,050,355
- Issue date Aug 14, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and method for forming joint structure of electroni...
- Patent number 9,691,546
- Issue date Jun 27, 2017
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, joint structure, electronic device, method for manu...
- Patent number 9,614,295
- Issue date Apr 4, 2017
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, bonding material, and method for producing elect...
- Patent number 9,572,255
- Issue date Feb 14, 2017
- MURATA MANUFACTURING CO., LTD.
- Akihiro Nomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part
- Patent number 9,412,517
- Issue date Aug 9, 2016
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 9,414,513
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, method for producing electronic device and electron...
- Patent number 9,409,247
- Issue date Aug 9, 2016
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic multilayer substrate and method for producing the same
- Patent number 9,370,111
- Issue date Jun 14, 2016
- Murata Manufacturing Co., Ltd.
- Yoshiko Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part
- Patent number 9,368,279
- Issue date Jun 14, 2016
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method, joint structure and method for producing the same
- Patent number 9,333,593
- Issue date May 10, 2016
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, joint structure, electronic device, method for manu...
- Patent number 9,209,527
- Issue date Dec 8, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and solder joint
- Patent number 9,162,324
- Issue date Oct 20, 2015
- Senju Metal Industry Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing the same
- Patent number 9,113,571
- Issue date Aug 18, 2015
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure
- Patent number 9,105,987
- Issue date Aug 11, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 8,975,527
- Issue date Mar 10, 2015
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and electronic device
- Patent number 8,920,580
- Issue date Dec 30, 2014
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic multilayer substrate and method for producing the same
- Patent number 8,802,998
- Issue date Aug 12, 2014
- Murata Manufacturing Co., Ltd.
- Yoshiko Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste and its use
- Patent number 8,227,536
- Issue date Jul 24, 2012
- Senju Metal Industry Co., Ltd.
- Shizuharu Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive bonding material and electronic apparatus
- Patent number 8,222,751
- Issue date Jul 17, 2012
- MURATA MANUFACTURING CO., LTD.
- Akihiro Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroconductive bonding material and electronic apparatus
- Patent number 8,105,687
- Issue date Jan 31, 2012
- MURATA MANUFACTURING CO., LTD.
- Akihiro Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Piezoelectric actuator
- Patent number 7,777,398
- Issue date Aug 17, 2010
- MURATA MANUFACTURING CO., LTD.
- Shodo Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder and soldered article
- Patent number 7,488,445
- Issue date Feb 10, 2009
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder and soldered article
- Patent number 7,422,721
- Issue date Sep 9, 2008
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick film electrode and multilayer ceramic electronic device
- Patent number 7,276,841
- Issue date Oct 2, 2007
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder and soldered article
- Patent number 7,022,282
- Issue date Apr 4, 2006
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REPAIR METHOD AND REPAIR MATERIAL
- Publication number 20180369951
- Publication date Dec 27, 2018
- Murata Manufacturing Co., Ltd.
- Satoshi Ishino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR JOINING STRUCTURAL MATERIAL, JOINING SHEET, AND JOINT ST...
- Publication number 20160297029
- Publication date Oct 13, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi Ishino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIR METHOD AND REPAIR MATERIAL
- Publication number 20160288245
- Publication date Oct 6, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi lshino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANU...
- Publication number 20160043480
- Publication date Feb 11, 2016
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Solder Bump, and Solder Bump
- Publication number 20150333027
- Publication date Nov 19, 2015
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE
- Publication number 20150239069
- Publication date Aug 27, 2015
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20150103495
- Publication date Apr 16, 2015
- MURATA MANUFACTURING CO., LTD.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MEMBER
- Publication number 20150072165
- Publication date Mar 12, 2015
- Murata Manufacturing Co., Ltd.
- Tomohiro Sunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC PART AND METHOD FOR FORMING JOINT STRUCTURE OF ELECTRONI...
- Publication number 20150034701
- Publication date Feb 5, 2015
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140363221
- Publication date Dec 11, 2014
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140356055
- Publication date Dec 4, 2014
- Kosuke Nakano
- C21 - METALLURGY OF IRON
Information Patent Application
JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRON...
- Publication number 20140345939
- Publication date Nov 27, 2014
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic Part
- Publication number 20140340816
- Publication date Nov 20, 2014
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140312539
- Publication date Oct 23, 2014
- Yoshiko OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECT...
- Publication number 20140218886
- Publication date Aug 7, 2014
- Murata Manufacturing Co., Ltd.
- Akihiro Nomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...
- Publication number 20140193650
- Publication date Jul 10, 2014
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...
- Publication number 20140178703
- Publication date Jun 26, 2014
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130343023
- Publication date Dec 26, 2013
- Hideo NAKAGOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MAN...
- Publication number 20130299236
- Publication date Nov 14, 2013
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Connection Structure
- Publication number 20130270001
- Publication date Oct 17, 2013
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRU...
- Publication number 20130233618
- Publication date Sep 12, 2013
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CIRCUIT BOARD
- Publication number 20120186860
- Publication date Jul 26, 2012
- Murata Manufacturing Co., Ltd.
- Hidekiyo TAKAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Bonding Material and Electronic Apparatus
- Publication number 20110067912
- Publication date Mar 24, 2011
- Murata Manufacturing Co., Ltd.
- Akhiro Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20100155118
- Publication date Jun 24, 2010
- Murata Manufacturing Co., Ltd.
- Yoshiko OKADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead-Free Solder Paste and Its Use
- Publication number 20100035072
- Publication date Feb 11, 2010
- Shizuharu Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste and Solder Joint
- Publication number 20090301607
- Publication date Dec 10, 2009
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Bonding Material and Electronic Apparatus
- Publication number 20090155608
- Publication date Jun 18, 2009
- Murata Manufacturing Co., Ltd.
- Akihiro Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Lead-free solder and soldered article
- Publication number 20080070059
- Publication date Mar 20, 2008
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Piezoelectric Actuator
- Publication number 20080007144
- Publication date Jan 10, 2008
- Shodo Takei
- H01 - BASIC ELECTRIC ELEMENTS

Hidekiyo Takaoka

Person

Patents Grantslast 30 patents

Repair method and repair material

Method for joining structural material, joining sheet, and joint st...

Method of forming solder bump, and solder bump

Conductive material, bonding method using the same, and bonded stru...

Solder paste, joining method using the same and joined structure

Electronic part and method for forming joint structure of electroni...

Joining method, joint structure, electronic device, method for manu...

Electronic device, bonding material, and method for producing elect...

Electronic part

Electronic component module

Joining method, method for producing electronic device and electron...

Ceramic multilayer substrate and method for producing the same

Electronic part

Joining method, joint structure and method for producing the same

Joining method, joint structure, electronic device, method for manu...

Solder paste and solder joint

Electronic component module and method for manufacturing the same

Connection structure

Solder paste, joining method using the same and joined structure

Circuit board

Solder paste and electronic device

Ceramic multilayer substrate and method for producing the same

Lead-free solder paste and its use

Electroconductive bonding material and electronic apparatus

Electroconductive bonding material and electronic apparatus

Piezoelectric actuator

Lead-free solder and soldered article

Lead-free solder and soldered article

Thick film electrode and multilayer ceramic electronic device

Lead-free solder and soldered article

Patents Applicationslast 30 patents

REPAIR METHOD AND REPAIR MATERIAL

METHOD FOR JOINING STRUCTURAL MATERIAL, JOINING SHEET, AND JOINT ST...

REPAIR METHOD AND REPAIR MATERIAL

JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANU...

Method of Forming Solder Bump, and Solder Bump

SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE

ELECTRONIC COMPONENT MODULE

BONDING MEMBER

ELECTRONIC PART AND METHOD FOR FORMING JOINT STRUCTURE OF ELECTRONI...

JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME

JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME

JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRON...

Electronic Part

CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME

ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECT...

ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...

ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME

JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MAN...

Connection Structure

CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRU...

CIRCUIT BOARD

Solder Paste, Joining Method Using the Same and Joined Structure

Electroconductive Bonding Material and Electronic Apparatus

CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME

Lead-Free Solder Paste and Its Use

Solder Paste and Solder Joint

Electroconductive Bonding Material and Electronic Apparatus

Lead-free solder and soldered article

Piezoelectric Actuator