Hidemi Nakamura

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive for packaging material, a packaging material, and a container
- Patent number 11,063,313
- Issue date Jul 13, 2021
- DIC Corporation
- Seiji Mizuta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
BATTERY PACKAGING MATERIAL ADHESIVE, BATTERY PACKAGING MATERIAL, BA...
- Publication number 20200106061
- Publication date Apr 2, 2020
- DIC CORPORATION
- Seiji Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING ADHESIVE, LAMINATE USING THE SAME, AND SECONDARY BATTERY
- Publication number 20190131595
- Publication date May 2, 2019
- DIC CORPORATION
- Hidemi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING ADHESIVE, MULTILAYER FILM, AND SECONDARY BATTERY PRODUCE...
- Publication number 20180248156
- Publication date Aug 30, 2018
- DIC CORPORATION
- Hidemi Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATING ADHESIVE, LAMINATE USING THE SAME, AND SECONDARY BATTERY
- Publication number 20170088753
- Publication date Mar 30, 2017
- DIC CORPORATION
- Hidemi Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION FOR ADHESIVE CONTAINING PLATE-LIKE INORGANIC COMP...
- Publication number 20140329950
- Publication date Nov 6, 2014
- DIC CORPORATION
- Mutsuhiro Shimoguchi
- B32 - LAYERED PRODUCTS