Hidemi Nawafune

Person

Kobe-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a circuit board
- Patent number 8,261,437
- Issue date Sep 11, 2012
- Toyota Jidosha Kabushiki Kaisha
- Hiroshi Yanagimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal film and metal wiring pattern, undercoat co...
- Patent number 8,071,178
- Issue date Dec 6, 2011
- Omron Corporation
- Seiji Nakajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming resin composite material
- Patent number 6,899,781
- Issue date May 31, 2005
- Shipley Company, L.L.C.
- Masaru Seita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PLATING SOLUTION AND METHOD FOR PRODUCING PLATED PRODUCT
- Publication number 20200040477
- Publication date Feb 6, 2020
- TECHNO ROLL CO., LTD.
- Hidemi NAWAFUNE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100270057
- Publication date Oct 28, 2010
- Toyota Jidosha Kabushiki Kaisha
- Hiroshi Yanagimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metal film and metal wiring pattern, undercoat co...
- Publication number 20100215979
- Publication date Aug 26, 2010
- Omron Corporation
- Seiji Nakajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Polyamide acid containing ultrafine metal particle
- Publication number 20090134364
- Publication date May 28, 2009
- Hidemi Nawafune
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for Producing Metal Nonoparticle Composite Film
- Publication number 20070212496
- Publication date Sep 13, 2007
- Satoshi Tomita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for forming inorganic thin film pattern on polyimide resin
- Publication number 20060165877
- Publication date Jul 27, 2006
- Mitsuboshi Belting Ltd.
- Hiroshi Yanagimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming inorganic thin film on polyimide resin and metho...
- Publication number 20060159854
- Publication date Jul 20, 2006
- Mitsuboshi Belting Ltd.
- Hiroshi Yanagimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming protective film and electroless plating bath
- Publication number 20050282384
- Publication date Dec 22, 2005
- Hidemi Nawafune
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Composite material with improved binding strength and method for fo...
- Publication number 20050164020
- Publication date Jul 28, 2005
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Resin composite material and method of forming the same
- Publication number 20040170846
- Publication date Sep 2, 2004
- Masaru Seita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Direct patterning method
- Publication number 20040101665
- Publication date May 27, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Composite material with improved binding strength and method for fo...
- Publication number 20040072015
- Publication date Apr 15, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming resin composite material
- Publication number 20040001957
- Publication date Jan 1, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- B32 - LAYERED PRODUCTS
Information Patent Application
Non-charging resin composite and method for manufacturing the same
- Publication number 20030003307
- Publication date Jan 2, 2003
- Shipley Company, L.L.C.
- Hideki Tsuchida
- H01 - BASIC ELECTRIC ELEMENTS

Hidemi Nawafune

Person

Patents Grantslast 30 patents

Method for manufacturing a circuit board

Method of forming metal film and metal wiring pattern, undercoat co...

Method for forming resin composite material

Patents Applicationslast 30 patents

PLATING SOLUTION AND METHOD FOR PRODUCING PLATED PRODUCT

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Method of forming metal film and metal wiring pattern, undercoat co...

Polyamide acid containing ultrafine metal particle

Process for Producing Metal Nonoparticle Composite Film

Method for forming inorganic thin film pattern on polyimide resin

Method for forming inorganic thin film on polyimide resin and metho...

Method for forming protective film and electroless plating bath

Composite material with improved binding strength and method for fo...

Resin composite material and method of forming the same

Direct patterning method

Composite material with improved binding strength and method for fo...

Method for forming resin composite material

Non-charging resin composite and method for manufacturing the same