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Hidenobu Miyamoto
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
7,615,498
Issue date
Nov 10, 2009
NEC Electronics Corporation
Yoichi Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing same
Patent number
7,341,937
Issue date
Mar 11, 2008
NEC Electronics Corporation
Koji Arita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
Patent number
7,180,191
Issue date
Feb 20, 2007
NEC Electronics Corporation
Yoichi Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing same
Patent number
6,927,495
Issue date
Aug 9, 2005
NEC Electronics Corporation
Koji Arita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device with via holes reachin...
Patent number
6,319,844
Issue date
Nov 20, 2001
NEC Corporation
Tatsuya Usami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus and fabrication method thereof
Patent number
5,937,300
Issue date
Aug 10, 1999
NEC Corporation
Makoto Sekine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing apparatus
Patent number
5,846,331
Issue date
Dec 8, 1998
NEC Corporation
Hidenobu Miyamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma generating apparatus used for fabrication of semiconductor d...
Patent number
5,810,932
Issue date
Sep 22, 1998
NEC Corporation
Yasuhiko Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for selectively etching polycide layer
Patent number
5,792,710
Issue date
Aug 11, 1998
NEC Corporation
Kazuyoshi Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing apparatus for manufacture of semiconductor devices
Patent number
5,690,781
Issue date
Nov 25, 1997
NEC Corporation
Kazuyoshi Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etching method for etching a semiconductor substrate having a silic...
Patent number
5,645,683
Issue date
Jul 8, 1997
NEC Corporation
Hidenobu Miyamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing fine-structured stacked connection layer
Patent number
5,407,862
Issue date
Apr 18, 1995
NEC Corporation
Hidenobu Miyamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device having groove-structu...
Patent number
5,340,769
Issue date
Aug 23, 1994
NEC Corporation
Hidenobu Miyamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of preventing corrosion of aluminum alloys
Patent number
5,246,888
Issue date
Sep 21, 1993
NEC Corporation
Hidenobu Miyamoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of manufacturing a semiconductor device
Publication number
20070117405
Publication date
May 24, 2007
NEC ELECTRONICS CORPORATION
Yoichi Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing same
Publication number
20050245075
Publication date
Nov 3, 2005
NEC Electronics Corporation
Koji Arita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing a semiconductor de...
Publication number
20050170633
Publication date
Aug 4, 2005
NEC Electronics Corporation
Yoichi Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing same
Publication number
20040036076
Publication date
Feb 26, 2004
NEC Electronics Corporation
Koji Arita
H01 - BASIC ELECTRIC ELEMENTS