Hidenobu TAKAHIRA

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Kurokawa-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having solder bumps and dummy bumps
- Patent number 7,525,201
- Issue date Apr 28, 2009
- FUJIFILM Corporation
- Hidenobu Takahira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20090166774
- Publication date Jul 2, 2009
- FUJIFILM CORPORATION
- Hidenobu TAKAHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting semiconductor chip to circuit substrate using so...
- Publication number 20080124837
- Publication date May 29, 2008
- Hidenobu Takahira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having solder bump
- Publication number 20060180928
- Publication date Aug 17, 2006
- Fuji Photo Film Co., Ltd.
- Hidenobu Takahira
- H01 - BASIC ELECTRIC ELEMENTS