Hidenori Hayashi

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board, and method and apparatus for manufacturing th...
- Patent number 6,671,951
- Issue date Jan 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, and method and apparatus for manufacturing th...
- Patent number 6,518,515
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co, LTD
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 6,365,844
- Issue date Apr 2, 2002
- Matsushita Electric Industrial Co., Ltd.
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing adhesive layer, apparatus for manufactu...
- Patent number 6,164,357
- Issue date Dec 26, 2000
- Matsushita Electric Industrial Co., Ltd.
- Akio Ochi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Printed wiring board, and method and apparatus for manufactujring t...
- Publication number 20020020556
- Publication date Feb 21, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshihiro Nishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board, and method and apparatus for manufacturing th...
- Publication number 20020020557
- Publication date Feb 21, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshihiro Nishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20010032700
- Publication date Oct 25, 2001
- TOSHIHIRO NISHII
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC