Hidenori Iida

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Niigata-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Shield method for electronic component enclosure and shield material
- Patent number 8,015,690
- Issue date Sep 13, 2011
- SMK Corporation
- Yoshikazu Ueno
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
- Publication number 20090239992
- Publication date Sep 24, 2009
- Toshiaki Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Shield method for electronic component enclosure and shield material
- Publication number 20090223711
- Publication date Sep 10, 2009
- Yoshikazu Ueno
- H04 - ELECTRIC COMMUNICATION TECHNIQUE