Hideo Aoba

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing wire wound electronic component
- Patent number 6,727,792
- Issue date Apr 27, 2004
- Taiyo Yuden Co., Ltd.
- Yoshihiro Amada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wire wound electronic component
- Patent number 6,449,830
- Issue date Sep 17, 2002
- Taiyo Yuden Co., Ltd.
- Yoshihiro Amada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip component and manufacturing method thereof
- Patent number 6,393,691
- Issue date May 28, 2002
- Taiyo Yuden Co., Ltd.
- Hideki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire wound electronic component
- Patent number 6,198,373
- Issue date Mar 6, 2001
- Taiyo Yuden Co., Ltd.
- Hideki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip inductor
- Patent number 6,154,112
- Issue date Nov 28, 2000
- Taiyo Yuden Co., Ltd.
- Hideo Aoba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire wound electronic component and method of manufacturing the same
- Patent number 6,144,280
- Issue date Nov 7, 2000
- Taiyo Yuden Co., Ltd.
- Yoshihiro Amada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing wire wound electronic component
- Publication number 20020190832
- Publication date Dec 19, 2002
- Taiyo Yuden Co., Ltd.
- Yoshihiro Amada
- H01 - BASIC ELECTRIC ELEMENTS