Hideo Kanzawa

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing circuit board and communication appliance
- Patent number 6,898,850
- Issue date May 31, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kanzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing circuit board and communication appliance
- Publication number 20040078969
- Publication date Apr 29, 2004
- Hideo Kanzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR