Hideo Kawai

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Packaging material for electronic-part case, and others
- Patent number 7,022,391
- Issue date Apr 4, 2006
- Showa Denko Packaging Co.
- Hideo Kawai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
Packaging material for electronic-part case, and others
- Publication number 20040142190
- Publication date Jul 22, 2004
- Hideo Kawai
- B32 - LAYERED PRODUCTS