Hideo Nakagoshi

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Vacuum device
- Patent number 10,861,683
- Issue date Dec 8, 2020
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-frequency module and manufacturing method therefor
- Patent number 10,559,535
- Issue date Feb 11, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing same
- Patent number 10,256,195
- Issue date Apr 9, 2019
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component module
- Patent number 9,414,513
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method for bonding metal plate and piezoelectric body
- Patent number 9,276,194
- Issue date Mar 1, 2016
- Murata Manufacturing Co., Ltd.
- Hiroki Kitayama
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electronic component module and method for manufacturing the same
- Patent number 9,113,571
- Issue date Aug 18, 2015
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding jig for electronic parts
- Patent number 8,726,494
- Issue date May 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Akio Katsube
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure for bonding metal plate and piezoelectric body and bondin...
- Patent number 8,492,959
- Issue date Jul 23, 2013
- Murata Manufacturing Co., Ltd.
- Hiroki Kitayama
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Semiconductor device, electronic component module, and method for m...
- Patent number 7,928,559
- Issue date Apr 19, 2011
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic parts
- Patent number 7,624,492
- Issue date Dec 1, 2009
- MURATA MANUFACTURING CO., LTD.
- Akio Katsube
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MODULE
- Publication number 20240389234
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCI...
- Publication number 20240312856
- Publication date Sep 19, 2024
- MURATA MANUFACTURING CO., LTD.
- Hiroki YOSHIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240237211
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138066
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20230335451
- Publication date Oct 19, 2023
- Murata Manufacturing Co., Ltd.
- Takamitsu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...
- Publication number 20230309230
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Tsuyoshi TAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, MODULE, METHOD FOR MANUFACTURING THE SUBSTRATE...
- Publication number 20230230907
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Tsuyoshi TAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180166394
- Publication date Jun 14, 2018
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180108618
- Publication date Apr 19, 2018
- MURATA MANUFACTURING CO., LTD.
- Issei Yamamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM DEVICE
- Publication number 20170250061
- Publication date Aug 31, 2017
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20150103495
- Publication date Apr 16, 2015
- MURATA MANUFACTURING CO., LTD.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130343023
- Publication date Dec 26, 2013
- Hideo NAKAGOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDIN...
- Publication number 20130276977
- Publication date Oct 24, 2013
- Hiroki KITAYAMA
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDIN...
- Publication number 20120091863
- Publication date Apr 19, 2012
- Murata Manufacturing Co., Ltd.
- Hiroki Kitayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HOLDING JIG FOR ELECTRONIC PARTS
- Publication number 20100018041
- Publication date Jan 28, 2010
- Murata Manufacturing Co., Ltd.
- Akio Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT MODULE, AND METHOD FOR M...
- Publication number 20090072383
- Publication date Mar 19, 2009
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Hideo Nakagoshi

Person

Patents Grantslast 30 patents

Vacuum device

High-frequency module and manufacturing method therefor

Module and method for manufacturing same

Electronic component module

Bonding method for bonding metal plate and piezoelectric body

Electronic component module and method for manufacturing the same

Holding jig for electronic parts

Structure for bonding metal plate and piezoelectric body and bondin...

Semiconductor device, electronic component module, and method for m...

Method for manufacturing electronic parts

Patents Applicationslast 30 patents

CIRCUIT MODULE

ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCI...

CIRCUIT MODULE

CIRCUIT MODULE

ELECTRONIC COMPONENT PACKAGE

ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...

SUBSTRATE STRUCTURE, MODULE, METHOD FOR MANUFACTURING THE SUBSTRATE...

HIGH-FREQUENCY MODULE AND MANUFACTURING METHOD THEREFOR

MODULE AND METHOD FOR MANUFACTURING SAME

VACUUM DEVICE

ELECTRONIC COMPONENT MODULE

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME

STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDIN...

STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDIN...

HOLDING JIG FOR ELECTRONIC PARTS

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT MODULE, AND METHOD FOR M...