Hideo Nakako

Person

Ibaraki-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,070,800
- Issue date Aug 27, 2024
- Resonac Corporation
- Yoshinori Ejiri
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing bonded object and semiconductor device and cop...
- Patent number 11,890,681
- Issue date Feb 6, 2024
- Resonac Corporation
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing thermoelectric conversion module, thermoel...
- Patent number 11,575,076
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Motohiro Negishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 11,532,588
- Issue date Dec 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing joined body, and joining material
- Patent number 11,483,936
- Issue date Oct 25, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,370,066
- Issue date Jun 28, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 11,040,416
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Dai Ishikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 10,930,612
- Issue date Feb 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for producing joined body, and met...
- Patent number 10,363,608
- Issue date Jul 30, 2019
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silver paste composition and semiconductor device using same
- Patent number 10,201,879
- Issue date Feb 12, 2019
- Hitachi Chemical Company, Ltd.
- Dai Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition and semiconductor device using same
- Patent number 10,174,226
- Issue date Jan 8, 2019
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition set, conductive substrate and method of producing the s...
- Patent number 9,676,969
- Issue date Jun 13, 2017
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching material
- Patent number 9,550,940
- Issue date Jan 24, 2017
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metal film, method for producing same, copper metal pattern,...
- Patent number 9,457,406
- Issue date Oct 4, 2016
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Compound having trimethylene structure, polymer compound containing...
- Patent number 9,051,246
- Issue date Jun 9, 2015
- Hitachi Chemical Company, Ltd.
- Shigeaki Funyuu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Copper conductor film and manufacturing method thereof, conductive...
- Patent number 8,801,971
- Issue date Aug 12, 2014
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR
- Publication number 20240300055
- Publication date Sep 12, 2024
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRO...
- Publication number 20240181575
- Publication date Jun 6, 2024
- Michiko NATORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE
- Publication number 20230356294
- Publication date Nov 9, 2023
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20220371087
- Publication date Nov 24, 2022
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRA...
- Publication number 20220230918
- Publication date Jul 21, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220053647
- Publication date Feb 17, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...
- Publication number 20220028824
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MEMBER CONNECTION METHOD
- Publication number 20210351157
- Publication date Nov 11, 2021
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20210143121
- Publication date May 13, 2021
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL
- Publication number 20200344893
- Publication date Oct 29, 2020
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...
- Publication number 20200295248
- Publication date Sep 17, 2020
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200130109
- Publication date Apr 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200108471
- Publication date Apr 9, 2020
- Hitachi Chemical Company, Ltd.
- Dai ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20190355690
- Publication date Nov 21, 2019
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...
- Publication number 20180250751
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ETCHING MATERIAL
- Publication number 20150299568
- Publication date Oct 22, 2015
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SILVER PASTE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20150217411
- Publication date Aug 6, 2015
- HITACHI CHEMICAL COMPANY, LTD.
- Dai Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20150137347
- Publication date May 21, 2015
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE S...
- Publication number 20140242362
- Publication date Aug 28, 2014
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN
- Publication number 20130295276
- Publication date Nov 7, 2013
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND HAVING TRIMETHYLENE STRUCTURE, POLYMER COMPOUND CONTAINING...
- Publication number 20120289674
- Publication date Nov 15, 2012
- KANAGAWA UNIVERSITY
- Shigeaki Funyuu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...
- Publication number 20120175147
- Publication date Jul 12, 2012
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT...
- Publication number 20120170241
- Publication date Jul 5, 2012
- Hideo Nakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...
- Publication number 20120125659
- Publication date May 24, 2012
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTIC...
- Publication number 20100233011
- Publication date Sep 16, 2010
- Hideo Nakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic Field Effect Transistor
- Publication number 20090134386
- Publication date May 28, 2009
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermosetting resin composition of low thermal expansibility and re...
- Publication number 20050065275
- Publication date Mar 24, 2005
- HITACHI CHEMICAL CO., Ltd.
- Atsushi Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hideo Nakako

Person

Patents Grantslast 30 patents

Electronic component and method for manufacturing electronic component

Method for producing bonded object and semiconductor device and cop...

Member connection method

Method for manufacturing thermoelectric conversion module, thermoel...

Copper paste for pressureless bonding, bonded body and semiconducto...

Method for producing joined body, and joining material

Metal paste for joints, assembly, production method for assembly, s...

Metal paste for joints, assembly, production method for assembly, s...

Copper paste for joining, method for manufacturing joined body, and...

Copper paste for pressureless bonding, bonded body and semiconducto...

Copper paste for joining, method for manufacturing joined body, and...

Assembly and semiconductor device

Copper paste for joining, method for producing joined body, and met...

Silver paste composition and semiconductor device using same

Adhesive composition and semiconductor device using same

Composition set, conductive substrate and method of producing the s...

Etching material

Copper metal film, method for producing same, copper metal pattern,...

Compound having trimethylene structure, polymer compound containing...

Copper conductor film and manufacturing method thereof, conductive...

Patents Applicationslast 30 patents

METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR

COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRO...

COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRA...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...

MEMBER CONNECTION METHOD

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL

METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

ASSEMBLY AND SEMICONDUCTOR DEVICE

COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...

ETCHING MATERIAL

SILVER PASTE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME

ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME

COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE S...

METHOD FOR FORMING A COPPER WIRING PATTERN

COMPOUND HAVING TRIMETHYLENE STRUCTURE, POLYMER COMPOUND CONTAINING...

COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...

PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT...

COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...

METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTIC...

Organic Field Effect Transistor

Thermosetting resin composition of low thermal expansibility and re...