Hideo Nakayoshi

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Yokohama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,071,576
- Issue date Jul 4, 2006
- Kabushiki Kaisha Toshiba
- Hideo Nakayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer
- Patent number 6,337,258
- Issue date Jan 8, 2002
- Kabushiki Kaisha Toshiba
- Hideo Nakayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,294,439
- Issue date Sep 25, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,184,109
- Issue date Feb 6, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050006766
- Publication date Jan 13, 2005
- Hideo Nakayoshi
- H01 - BASIC ELECTRIC ELEMENTS