Hideo Oikawa

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Koganei, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of connecting wirings through connection hole
- Patent number 5,320,979
- Issue date Jun 14, 1994
- Nippon Telegraph & Telephone Corporation
- Chisato Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-purity metal and metal silicide target for LSI electrodes
- Patent number 4,770,948
- Issue date Sep 13, 1988
- Nihon Kogyo Kabushiki Kaisha
- Hideo Oikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Thin film forming apparatus and method
- Patent number 4,732,761
- Issue date Mar 22, 1988
- Nippon Telegraph & Telephone Corporation
- Katsuyuki Machida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing high-purity metal targets for LSI electrodes
- Patent number 4,619,695
- Issue date Oct 28, 1986
- Nihon Kogyo Kabushiki Kaisha
- Hideo Oikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 4,557,036
- Issue date Dec 10, 1985
- Nippon Telegraph and Telephone Public Corp.
- Hakaru Kyuragi
- H01 - BASIC ELECTRIC ELEMENTS