Hideo Otsuka

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Tochigi-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for preparing a circuit board material having a conductive b...
- Patent number 7,794,578
- Issue date Sep 14, 2010
- The Furukawa Electric Co., Ltd.
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate with resistance layer, resistance board, and r...
- Patent number 7,215,235
- Issue date May 8, 2007
- Furukawa Circuit Foil Co., LTD
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for chip-on-film use, plasma display panel, or high-fre...
- Patent number 7,172,818
- Issue date Feb 6, 2007
- Furukawa Circuit Foil Co., Ltd.
- Tadao Nakaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil for fine pattern and method for produc...
- Patent number 5,834,140
- Issue date Nov 10, 1998
- Circuit Foil Japan Co., Ltd.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Conductive substrate with resistance layer, resistance board, and r...
- Publication number 20040201446
- Publication date Oct 14, 2004
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating bath for forming thin resistance layer, method of formation...
- Publication number 20040144656
- Publication date Jul 29, 2004
- Akira Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for chip-on-film use, plasma display panel, or high-fre...
- Publication number 20040043242
- Publication date Mar 4, 2004
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Tadao Nakaoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited copper foil and electrodeposited copper foil for s...
- Publication number 20040029006
- Publication date Feb 12, 2004
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Hideo Otsuka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR