Hideo Senoo

Person

Kawaguchi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Coating composition, coating film, method of manufacturing coating...
- Patent number 7,589,130
- Issue date Sep 15, 2009
- Lintec Corporation
- Yuki Hongo
- G11 - INFORMATION STORAGE
Information Patent Grant
Sheet to form a protective film for chips
- Patent number 7,408,259
- Issue date Aug 5, 2008
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating composition, hard coat film, and optical disk
- Patent number 7,384,676
- Issue date Jun 10, 2008
- Lintec Corporation
- Yuki Hongo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor wafer protection structure and laminated protective s...
- Patent number 7,361,971
- Issue date Apr 22, 2008
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor chips having a protective film...
- Patent number 7,235,465
- Issue date Jun 26, 2007
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device
- Patent number 7,169,648
- Issue date Jan 30, 2007
- Lintec Corporation
- Akinori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape
- Patent number 7,135,224
- Issue date Nov 14, 2006
- Lintec Corporation
- Takaji Sumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing semiconductor chips
- Patent number 6,919,262
- Issue date Jul 19, 2005
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for forming resin tie bar, resin tie bar, lead frame equipped...
- Patent number 6,855,418
- Issue date Feb 15, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement material for silicon wafer and process for producing...
- Patent number 6,765,289
- Issue date Jul 20, 2004
- Lintec Corporation
- Yasukazu Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device
- Patent number 6,656,819
- Issue date Dec 2, 2003
- Lintec Corporation
- Takashi Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device
- Patent number 6,558,975
- Issue date May 6, 2003
- Lintec Corporation
- Takashi Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a transfer tape
- Patent number 6,544,371
- Issue date Apr 8, 2003
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape and a method of dicing a semiconductor wafer
- Patent number 6,444,310
- Issue date Sep 3, 2002
- Lintec Corporation
- Hideo Senoo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process for preparing a semiconductor wafer
- Patent number 6,297,076
- Issue date Oct 2, 2001
- Lintec Corporation
- Masazumi Amagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 6,277,481
- Issue date Aug 21, 2001
- Lintec Corporation
- Takashi Sugino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive sheet for wafer setting and process for producing electron...
- Patent number 6,042,922
- Issue date Mar 28, 2000
- Lintec Corporation
- Hideo Senoo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of preventing transfer of adhesive substance to dicing ring...
- Patent number 5,888,606
- Issue date Mar 30, 1999
- Lintec Corporation
- Hideo Senoo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of preventing transfer of adhesive substance to dicing ring...
- Patent number 5,705,016
- Issue date Jan 6, 1998
- Lintec Corporation
- Hideo Senoo
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Coating composition, coating film, method of manufacturing coating...
- Publication number 20090291248
- Publication date Nov 26, 2009
- LINTEC CORPORATION
- Yuki Hongo
- G11 - INFORMATION STORAGE
Information Patent Application
Sheet to Form a Protective Shield for Chips
- Publication number 20080260982
- Publication date Oct 23, 2008
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective structure of semiconductor wafer, method for protecting...
- Publication number 20060043532
- Publication date Mar 2, 2006
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating composition, coating film, method of manufacturing coating...
- Publication number 20060044993
- Publication date Mar 2, 2006
- Yuki Hongo
- G11 - INFORMATION STORAGE
Information Patent Application
Process for producing semiconductor chips having a protective film...
- Publication number 20050186762
- Publication date Aug 25, 2005
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet to form a protective film for chips
- Publication number 20050184402
- Publication date Aug 25, 2005
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating composition, hard coat film, and optical disk
- Publication number 20050147809
- Publication date Jul 7, 2005
- Yuki Hongo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing a semiconductor device
- Publication number 20050037542
- Publication date Feb 17, 2005
- LINTEC CORPORATION
- Akinori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive tape
- Publication number 20040232563
- Publication date Nov 25, 2004
- Takaji Sumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Tape for forming resin tie bar, resin tie bar, lead frame equipped...
- Publication number 20020192464
- Publication date Dec 19, 2002
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet to form a protective film for chips and process for producing...
- Publication number 20020137309
- Publication date Sep 26, 2002
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing semiconductor device
- Publication number 20020055238
- Publication date May 9, 2002
- LINTEC CORPORATION
- Takashi Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforcement material for silicone wafer and process for producing...
- Publication number 20020031863
- Publication date Mar 14, 2002
- Yasukazu Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using a transfer tape
- Publication number 20020028331
- Publication date Mar 7, 2002
- LINTEC CORPORATION
- Hideo Senoo
- B32 - LAYERED PRODUCTS

Hideo Senoo

Person

Patents Grantslast 30 patents

Coating composition, coating film, method of manufacturing coating...

Sheet to form a protective film for chips

Coating composition, hard coat film, and optical disk

Semiconductor wafer protection structure and laminated protective s...

Process for producing semiconductor chips having a protective film...

Process for producing a semiconductor device

Adhesive tape

Process for producing semiconductor chips

Tape for forming resin tie bar, resin tie bar, lead frame equipped...

Reinforcement material for silicon wafer and process for producing...

Process for producing semiconductor device

Process for producing semiconductor device

Method of using a transfer tape

Dicing tape and a method of dicing a semiconductor wafer

Process for preparing a semiconductor wafer

Adhesive composition and adhesive sheet

Adhesive sheet for wafer setting and process for producing electron...

Method of preventing transfer of adhesive substance to dicing ring...

Method of preventing transfer of adhesive substance to dicing ring...

Patents Applicationslast 30 patents

Coating composition, coating film, method of manufacturing coating...

Sheet to Form a Protective Shield for Chips

Protective structure of semiconductor wafer, method for protecting...

Coating composition, coating film, method of manufacturing coating...

Process for producing semiconductor chips having a protective film...

Sheet to form a protective film for chips

Coating composition, hard coat film, and optical disk

Process for producing a semiconductor device

Adhesive tape

Tape for forming resin tie bar, resin tie bar, lead frame equipped...

Sheet to form a protective film for chips and process for producing...

Process for producing semiconductor device

Reinforcement material for silicone wafer and process for producing...

Method of using a transfer tape