Hideo Shiraishi

Person

  • Atugi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding method and apparatus

    • Patent number 5,251,805
    • Issue date Oct 12, 1993
    • Hitachi, Ltd.
    • Mitsukiyo Tani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding method and bonding apparatus

    • Patent number 5,002,217
    • Issue date Mar 26, 1991
    • Hitachi, Ltd.
    • Mitsukiyo Tani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR