Hideshi Miyajima

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,417,626
- Issue date Aug 16, 2022
- Kioxia Corporation
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,008,190
- Issue date Aug 30, 2011
- Kabushiki Kaisha Toshiba
- Nobuhide Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for film formation, insulating film, semiconductor devi...
- Patent number 7,999,356
- Issue date Aug 16, 2011
- Kabushiki Kaisha Toshiba
- Yasushi Nakasaki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device having multiple wiring layers and method of pr...
- Patent number 7,855,141
- Issue date Dec 21, 2010
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,842,518
- Issue date Nov 30, 2010
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple wiring layers and method of pr...
- Patent number 7,745,326
- Issue date Jun 29, 2010
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple wiring layers and method of pr...
- Patent number 7,589,014
- Issue date Sep 15, 2009
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,569,498
- Issue date Aug 4, 2009
- Kabushiki Kaisha Toshiba
- Hideaki Masuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,534,717
- Issue date May 19, 2009
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,462,569
- Issue date Dec 9, 2008
- Kabushiki Kaisha Toshiba
- Keiji Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,329,601
- Issue date Feb 12, 2008
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,199,038
- Issue date Apr 3, 2007
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,154,179
- Issue date Dec 26, 2006
- Sony Corporation
- Kiyotaka Tabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,129,175
- Issue date Oct 31, 2006
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 7,094,681
- Issue date Aug 22, 2006
- Kabushiki Kaisha Toshiba
- Keiji Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,962,870
- Issue date Nov 8, 2005
- Kabushiki Kaisha Toshiba
- Hideaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming insulating film and method of manufacturing semic...
- Patent number 6,784,092
- Issue date Aug 31, 2004
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,746,969
- Issue date Jun 8, 2004
- Kabushiki Kaisha Toshiba
- Miyoko Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,737,363
- Issue date May 18, 2004
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a low dielectric insulation layer
- Patent number 6,703,302
- Issue date Mar 9, 2004
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device and a semiconductor...
- Patent number 6,614,096
- Issue date Sep 2, 2003
- Kabushiki Kaisha Toshiba
- Akihiro Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming insulating film and process for producing semicon...
- Patent number 6,558,747
- Issue date May 6, 2003
- Kabushiki Kaisha Toshiba
- Rempei Nakata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Apparatus and method for manufacturing a semiconductor device
- Patent number 6,534,870
- Issue date Mar 18, 2003
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,458,713
- Issue date Oct 1, 2002
- Kabushiki Kaisha Toshiba
- Nobuhide Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having low dielectric...
- Patent number 6,436,849
- Issue date Aug 20, 2002
- Kabushiki Kaisha Toshiba
- Masahiko Hasunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 6,344,420
- Issue date Feb 5, 2002
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CVD apparatus with high throughput and cleaning method therefor
- Patent number 6,164,295
- Issue date Dec 26, 2000
- Kabushiki Kaisha Toshiba
- Akio Ui
- B08 - CLEANING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,153,509
- Issue date Nov 28, 2000
- Kabushiki Kaisha Toshiba
- Kei Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 6,051,508
- Issue date Apr 18, 2000
- Kabushiki Kaisha Toshiba
- Tamao Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase processing apparatus
- Patent number 5,885,352
- Issue date Mar 23, 1999
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210074672
- Publication date Mar 11, 2021
- Kioxia Corporation
- Mie MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FILM FORMATION, INSULATING FILM, SEMICONDUCTOR DEVI...
- Publication number 20100072581
- Publication date Mar 25, 2010
- Kabushiki Kaisha Toshiba
- Yasushi Nakasaki
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE WIRING LAYERS AND METHOD OF PR...
- Publication number 20090275194
- Publication date Nov 5, 2009
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080318408
- Publication date Dec 25, 2008
- Nobuhide YAMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080216746
- Publication date Sep 11, 2008
- Keiji Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080194117
- Publication date Aug 14, 2008
- Hideaki Masuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20080108153
- Publication date May 8, 2008
- Hideshi MIYAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVE MULTIPLE WIRING LAYERS AND METHOD OF PROD...
- Publication number 20070093052
- Publication date Apr 26, 2007
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060199373
- Publication date Sep 7, 2006
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060017164
- Publication date Jan 26, 2006
- Kiyotaka Tabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050250311
- Publication date Nov 10, 2005
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050233583
- Publication date Oct 20, 2005
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20050112877
- Publication date May 26, 2005
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor device
- Publication number 20050112863
- Publication date May 26, 2005
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20040175930
- Publication date Sep 9, 2004
- Hideaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20040166680
- Publication date Aug 26, 2004
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040135254
- Publication date Jul 15, 2004
- Keiji Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming low dielectric constant insulating layer and meth...
- Publication number 20030143847
- Publication date Jul 31, 2003
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20030001278
- Publication date Jan 2, 2003
- Akihiro Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device have multiple wiring layers and method of prod...
- Publication number 20020187625
- Publication date Dec 12, 2002
- Kabushiki Kaisha Toshiba
- Yoshiaki Shimooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20020173138
- Publication date Nov 21, 2002
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming insulating film and method of manufacturing semic...
- Publication number 20020142623
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming insulating film and process for producing semicon...
- Publication number 20020086169
- Publication date Jul 4, 2002
- Kabushiki Kaisha Toshiba
- Rempei Nakata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020081863
- Publication date Jun 27, 2002
- Miyoko Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020061657
- Publication date May 23, 2002
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC...
- Publication number 20020037655
- Publication date Mar 28, 2002
- Kabushiki Kaisha Toshiba
- Masahiko Hasunuma
- H01 - BASIC ELECTRIC ELEMENTS

Hideshi Miyajima

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor device

Method of manufacturing semiconductor device

Composition for film formation, insulating film, semiconductor devi...

Semiconductor device having multiple wiring layers and method of pr...

Method for fabricating semiconductor device

Semiconductor device having multiple wiring layers and method of pr...

Semiconductor device having multiple wiring layers and method of pr...

Manufacturing method of semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method for fabricating semiconductor device

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device fabrication method

Method of manufacturing semiconductor device and semiconductor device

Method of forming insulating film and method of manufacturing semic...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of making a low dielectric insulation layer

Method for manufacturing a semiconductor device and a semiconductor...

Method of forming insulating film and process for producing semicon...

Apparatus and method for manufacturing a semiconductor device

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device having low dielectric...

Plasma processing method and plasma processing apparatus

CVD apparatus with high throughput and cleaning method therefor

Method of manufacturing a semiconductor device

Manufacturing method of semiconductor device

Vapor phase processing apparatus

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

COMPOSITION FOR FILM FORMATION, INSULATING FILM, SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICE HAVING MULTIPLE WIRING LAYERS AND METHOD OF PR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVE MULTIPLE WIRING LAYERS AND METHOD OF PROD...

Method of manufacturing semiconductor device

Semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

Method for fabricating semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Method of forming low dielectric constant insulating layer and meth...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

Semiconductor device have multiple wiring layers and method of prod...

Method for manufacturing a semiconductor device

Method of forming insulating film and method of manufacturing semic...

Method of forming insulating film and process for producing semicon...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC...