Hideshi Tokuhira

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus
- Patent number 7,978,470
- Issue date Jul 12, 2011
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including electronic component, heat dissipating...
- Patent number 7,911,795
- Issue date Mar 22, 2011
- Fujitsu Limited
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer sheet, heat transfer structural body and manufacturin...
- Patent number 7,610,678
- Issue date Nov 3, 2009
- Fujitsu Limited
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-absorbing member, cooling device, and electronic apparatus
- Patent number 7,551,435
- Issue date Jun 23, 2009
- Fujitsu Limited
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus
- Patent number 7,502,227
- Issue date Mar 10, 2009
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component and radiating member, and method of manufactur...
- Patent number 7,362,577
- Issue date Apr 22, 2008
- Fujitsu Limited
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic equipment
- Patent number 7,155,914
- Issue date Jan 2, 2007
- Fujitsu Limited
- Minoru Ishinabe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adhesive composition
- Patent number 6,790,881
- Issue date Sep 14, 2004
- Fujitsu Limited
- Hiroaki Date
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive, bonding method and assembly of mounting substrate
- Patent number 6,576,081
- Issue date Jun 10, 2003
- Fujitsu Limited
- Hiroaki Date
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20090052135
- Publication date Feb 26, 2009
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT AND RADIATING MEMBER, AND METHOD OF MANUFACTUR...
- Publication number 20080198553
- Publication date Aug 21, 2008
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-absorbing member, cooling device, and electronic apparatus
- Publication number 20080055860
- Publication date Mar 6, 2008
- FUJITSU LIMITED
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat exchanger for liquid cooling
- Publication number 20070000655
- Publication date Jan 4, 2007
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat receiving member, heat receiving device and electronic equipment
- Publication number 20060209512
- Publication date Sep 21, 2006
- FUJITSU LIMITED
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic apparatus
- Publication number 20060133032
- Publication date Jun 22, 2006
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Radiating fin and method for manufacturing the same
- Publication number 20060065970
- Publication date Mar 30, 2006
- FUJITSU LIMITED
- Hiroki Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic apparatus
- Publication number 20060038285
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat transfer sheet, heat transfer structural body and manufacturin...
- Publication number 20060037741
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and radiating member, and method of manufactur...
- Publication number 20060028799
- Publication date Feb 9, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling structure for electronic equipment
- Publication number 20060005549
- Publication date Jan 12, 2006
- FUJITSU LIMITED
- Minoru Ishinabe
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Adhesive composition
- Publication number 20030069333
- Publication date Apr 10, 2003
- FUJITSU LIMITED
- Hiroaki Date
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE, BONDING METHOD AND ASSEMBLY OF MOUNTING SUBSTRATE
- Publication number 20020084019
- Publication date Jul 4, 2002
- HIROAKI DATE
- H01 - BASIC ELECTRIC ELEMENTS

Hideshi Tokuhira

Person

Patents Grantslast 30 patents

Electronic apparatus

Electronic device including electronic component, heat dissipating...

Heat transfer sheet, heat transfer structural body and manufacturin...

Heat-absorbing member, cooling device, and electronic apparatus

Electronic apparatus

Electronic component and radiating member, and method of manufactur...

Cooling structure for electronic equipment

Adhesive composition

Adhesive, bonding method and assembly of mounting substrate

Patents Applicationslast 30 patents

ELECTRONIC APPARATUS

ELECTRONIC COMPONENT AND RADIATING MEMBER, AND METHOD OF MANUFACTUR...

Heat-absorbing member, cooling device, and electronic apparatus

Heat exchanger for liquid cooling

Heat receiving member, heat receiving device and electronic equipment

Electronic apparatus

Radiating fin and method for manufacturing the same

Electronic apparatus

Heat transfer sheet, heat transfer structural body and manufacturin...

Electronic component and radiating member, and method of manufactur...

Cooling structure for electronic equipment

Adhesive composition

ADHESIVE, BONDING METHOD AND ASSEMBLY OF MOUNTING SUBSTRATE